Substrate Support Temperature Transition Reduction
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Solution Overview
Problem
Substrate processing systems face challenges in maintaining uniform substrate temperatures during processes like etching and deposition, leading to non-uniform critical dimensions and reduced throughput due to temperature variations in the substrate and processing components.
Innovation Solution
A system comprising a substrate support device, a temperature sensor, and a thermal control element (TCE) is used to control the substrate temperature by preheating or precooling the electrostatic chuck before loading the substrate, utilizing macro and micro TCEs to adjust the temperature to the desired processing temperature, thereby reducing the time required to reach the processing temperature and increasing system throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate support device temperature is adjusted to the desired processing temperature before substrate loading, then the substrate temperature uniformity is improved, but the system throughput is reduced due to the time required for temperature stabilization
Solution Approach 1:
The system performs preliminary temperature adjustment of the substrate support device before substrate loading. The controller determines a preliminary temperature adjustment amount based on the temperature difference between the current substrate support device temperature and the desired processing temperature, applying this adjustment in advance to reduce the time needed after substrate loading.
Solution Approach 2:
The system uses temperature sensors to continuously monitor the substrate support device temperature and implements a feedback control mechanism. The controller adjusts the thermal control element based on the measured temperature difference, creating a closed-loop control system that maintains accurate temperature control while optimizing response time.
2Measurement precision
If the thermal control element is continuously adjusted to maintain desired temperature, then the temperature control precision is improved, but the energy consumption increases
Solution Approach 1:
The system applies partial temperature adjustment by calculating a preliminary temperature adjustment amount that is sufficient to reach the desired temperature without over-adjustment. This avoids excessive heating or cooling cycles, reducing energy consumption while maintaining temperature control precision.
Solution Approach 2:
The substrate itself serves as a thermal mass that helps stabilize the substrate support device temperature. Once the preliminary adjustment is made, the substrate's thermal properties assist in maintaining the desired temperature, reducing the need for continuous active heating or cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively controls substrate temperatures to match the desired processing temperature before processing, reducing the time needed to reach the target temperature and enhancing the throughput of the substrate processing system by learning from previous substrate control adjustments.
Implementation Method 1
The TCE is configured to selectively heat the substrate support device
Implementation Method 2
The temperature sensor is configured to sense a temperature of the substrate support device
Data Source
AI summary
A temperature controller for a substrate processing system includes an interface configured to receive a processing temperature corresponding to a desired processing temperature of a substrate. The temperature controller includes a thermal control element controller configured to selectively control a thermal control element to adjust a temperature of a substrate support. The thermal control element controller is further configured to, prior to the substrate being loaded onto the substrate support, determine at least one of a temperature of the substrate support and a temperature of the substrate and, based on the processing temperature and the at least one of the temperature of the substrate support and the temperature of the substrate, control the thermal control element to adjust the temperature of the substrate support to a setpoint temperature that is different than the processing temperature.