Multi-Zone Substrate Support for Precise Temperature Profiles
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Solution Overview
Problem
Conventional substrate supports in semiconductor manufacturing do not provide the desired temperature profile for specific processes, necessitating a substrate support with multi-zone temperature control.
Innovation Solution
A substrate support apparatus with distinct regions having different temperature profiles, varied contact resistances, emissivities, and surface roughness, combined with embedded channels and heating elements for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional substrate support is used, then the structure is simple, but the temperature profile control is insufficient
Solution Approach 1:
The substrate support body is divided into multiple heating zones (first heating zone, second heating zone, third heating zone) with independent temperature control. Each zone has dedicated heating elements and thermal isolation structures, allowing separate temperature regulation to achieve complex temperature profiles while maintaining manageable system complexity through modular design
Solution Approach 2:
Different regions of the substrate support are equipped with different heating powers and thermal conductivities to create specific temperature distributions. The first heating zone has higher heating power for central regions requiring higher temperatures, while outer regions have lower heating power, creating a non-uniform temperature profile tailored to process requirements
2Temperature
If multiple heating zones are implemented, then temperature profile control is improved, but energy consumption increases
Solution Approach 1:
The heating elements in different zones are controlled dynamically with independent power regulation. The system can adjust heating power in each zone based on real-time temperature feedback and process requirements, enabling energy optimization by applying heat only where and when needed rather than uniform heating across the entire substrate support
Solution Approach 2:
The system changes heating parameters (power, duration, distribution) across different zones to match process requirements. By varying heating power density and thermal conductivity in different regions, the system achieves efficient energy utilization by concentrating energy in zones requiring higher temperatures while reducing energy input in zones with lower temperature requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and customizable temperature control across different regions of a substrate, enhancing processing efficiency and consistency in semiconductor manufacturing.
Implementation Method 1
a plurality of heating elements embedded within the body
Implementation Method 2
a body, formed from a ceramic material... a plurality of heating elements embedded within the body
Data Source
AI summary
Various embodiments of the present technology may provide a substrate support apparatus with a surface having a first region with a first temperature profile, a second region having a second temperature profile; and a third region having a third temperature profile. The substrate support apparatus may also have a first channel embedded within the body and disposed between the first region and the second region, and a second channel disposed between the second region and the third region.