Substrate Support Temperature Zoning to Prevent Warpage

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Solution Overview

Problem

In inspection apparatuses for semiconductor devices, existing temperature control methods either result in substrate warpage or inadequate heat absorption, making it difficult to accurately inspect devices with high heat generation due to high integration and speed, especially when using local centralized control or overall uniform control.

Innovation Solution

A method for controlling the temperature of a substrate support by dividing its surface into regions, with feedback control in the main region corresponding to the inspection target and separate control in adjacent sub-regions to manage temperature differences, preventing warpage and improving heat absorption performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If local centralized control is used to improve heat absorption performance, then heat absorption performance is improved, but substrate warpage occurs

Engineering Contradiction:
Improveheat absorption performanceVSAvoidsubstrate warpage
Core Design Contradiction:
ReliabilityVSShape

Solution Approach 1:

The substrate support surface is divided into multiple regions (main region and sub-regions) with independent temperature control. This segmentation allows different heating strategies to be applied to different areas, enabling the main region to absorb heat effectively while sub-regions maintain temperature to prevent warpage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different control strategies are applied to different regions: the main region uses feedback control optimized for heat absorption, while sub-regions use control strategies optimized for preventing temperature differences and warpage. This local quality approach allows each region to have tailored temperature management.

Inventive Principle:
Principle #3Local quality

2Shape

If overall uniform control is used to prevent substrate warpage, then warpage is prevented, but heat absorption performance deteriorates

Engineering Contradiction:
Improvesubstrate uniformityVSAvoidheat absorption performance
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The substrate support is divided into multiple regions with independent control, allowing the main region to use aggressive heating for heat absorption while sub-regions use conservative heating to maintain uniformity and prevent warpage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The main region receives excessive heating action to ensure adequate heat absorption performance, while sub-regions receive partial heating action just sufficient to prevent warpage, optimizing the overall system performance.

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for accurate and efficient temperature maintenance of inspection target devices without warpage, enhancing the heat absorption performance of the substrate support and enabling precise electrical characteristic inspections, even with high heat generation devices.

Implementation Method 1

performing feed-back control of the heater in a main region corresponding to the inspection target device among the multiple regions such that a temperature of the main region becomes a set temperature

Methodology Applied
Scientific EffectFeedback control: Feedback

Implementation Method 2

controlling the heater in a sub-region adjacent to the main region among the multiple regions... the heater of the sub-region is controlled such that a temperature difference between the set temperature and the temperature in the sub-region becomes the predetermined value

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20220015193A1Method for controlling temperature of substrate support and inspection apparatus
Publication Date: 2022.01.13 TOKYO ELECTRON LTD
  • US20220015193A1 patent drawing
  • US20220015193A1 patent drawing
  • US20220015193A1 patent drawing

AI summary

A method for adjusting a temperature of a substrate support is provided. In an apparatus for inspecting a target device, a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions. The method comprises controlling the heater in a main region corresponding to the target device such that a temperature of the main region becomes a set temperature, and controlling the heater in a sub-region adjacent to the main region. When overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes a predetermined value, and when overshoot has occurred, the heater of the sub-region is controlled such that a difference between the set temperature and the temperature in the sub-region becomes the predetermined value.