Backside-Pocket Substrate Support for Faster Thermal Cycling
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Solution Overview
Problem
Conventional substrate supports have high thermal mass, leading to increased process energy consumption, prolonged response times, and reduced process uniformity.
Innovation Solution
A disk-shaped substrate support with a backside pocket and a ring extending radially inward from its edge, featuring lift pin openings and slots, which reduces thermal mass and weight, allowing for faster thermal cycling and easier transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If conventional substrate supports are used, then structural strength and stability are maintained, but thermal mass is high leading to increased energy consumption and prolonged response time
Solution Approach 1:
The substrate support is segmented by introducing pockets (front side pocket and backside pocket) that divide the solid disk structure into regions of varying density. This segmentation reduces overall thermal mass while maintaining structural integrity through strategic placement of material regions
Solution Approach 2:
The design transitions from a conventional solid two-dimensional disk to a three-dimensional structure with varying thickness and density distribution. The pockets create depth variations that reduce thermal mass while the ring structure provides dimensional stability
2Speed
If conventional substrate supports are used, then structural integrity is maintained, but response time is prolonged
Solution Approach 1:
By segmenting the substrate support structure into pockets and solid regions, the thermal mass is reduced without compromising the structural framework. This allows faster heating and cooling cycles while maintaining the necessary mechanical strength
Solution Approach 2:
Different regions of the substrate support have different properties: the ring and lift pin openings provide structural strength where needed, while the pockets reduce thermal mass in regions where full density is not required. This local differentiation optimizes both speed and strength
3Manufacturing precision
If conventional substrate supports are used, then manufacturing simplicity is maintained, but process uniformity is reduced
Solution Approach 1:
The substrate support features local quality variations with different pocket depths and ring positions optimized for specific functional requirements. This allows precise control over thermal characteristics while maintaining manufacturing feasibility through standardized formation processes
Data Source
AI summary
Systems and apparatus for a reduced mass substrate support are disclosed, according to certain embodiments. A front side pocket is provided for support of a substrate, while a backside pocket is provided that reduces the mass of the substrate support. By providing the backside pocket, the mass of the overall substrate support is reduced, providing faster thermal cycling times for the substrate support and reducing the weight of the substrate support for transport. Lift pin systems, according to disclosed embodiments, are compatible with existing pedestal systems by providing a hollow extension from each lift pin hole that extends from a bottom of the backside pocket to provide support for lift pin insertion and operation.