Rotatable Substrate Support Isolation for Faster Wafer Throughput
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The throughput of semiconductor device manufacturing is hindered by the need to wait for substrates to cool down after processing, leading to decreased efficiency due to heat conduction issues between substrates.
Innovation Solution
A substrate processing apparatus with a rotatable table and heat conduction insulators, such as a vacuum thermal-insulation material or inert gas suppliers, to thermally isolate substrate supports and prevent heat transfer between substrates during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are processed in a process furnace at high temperature, then substrate processing is completed, but the substrates must wait to cool down which decreases throughput
Solution Approach 1:
The substrate support is divided into multiple independent support portions (first support portion and second support portion) that can be thermally isolated from each other. This segmentation allows one substrate to be cooled while another is being processed, eliminating the need for complete system cooling and thereby improving throughput.
Solution Approach 2:
A heat conduction insulator is introduced as an intermediary element between the first support portion and the second support portion. This insulator prevents heat transfer between substrates, allowing the processed substrate to cool down without heating the unprocessed substrate, thus reducing cooling time and increasing productivity.
2Productivity
If multiple substrate supports are placed on a rotatable table, then simultaneous processing and transfer is enabled, but heat conduction between supports occurs
Solution Approach 1:
Heat conduction insulators are positioned between adjacent support portions on the rotatable table to block thermal transfer. This allows multiple substrates to be processed and transferred simultaneously while preventing harmful heat conduction from hot substrates to cold substrates through the support structure.
Solution Approach 2:
The insulating properties are applied locally at the interfaces between support portions rather than throughout the entire table structure. This targeted approach prevents heat conduction between supports while maintaining the overall functionality of the rotatable table for simultaneous processing and transfer operations.
3Stability of the object's composition
If substrate supports are thermally connected, then structural stability is maintained, but heat transfer between substrates causes oxidation and crystal growth
Solution Approach 1:
Heat conduction insulators are introduced as intermediary elements between support portions to block thermal pathways. This prevents heat transfer that would cause oxidation and crystal growth on unprocessed substrates, while the support structure maintains sufficient structural stability to hold and position substrates during processing.
Solution Approach 2:
The support structure is segmented into thermally isolated sections, each capable of maintaining local structural stability. The heat conduction insulators at the interfaces ensure that thermal energy does not propagate between segments, preventing harmful effects like oxidation and crystal growth while preserving mechanical support functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances throughput by minimizing the impact of heat on unprocessed substrates, preventing oxidation and crystal growth, while allowing for simultaneous processing and transfer of substrates, thus improving manufacturing efficiency.
Implementation Method 1
a heat conduction insulator configured to suppress heat conduction between the plurality of supports
Data Source
AI summary
There is provided a technique that includes a process chamber in which a substrate is processed; a plurality of substrate supports configured to support the substrate; a rotatable table including a plurality of supports configured to support the plurality of substrate supports; and a heat conduction insulator configured to suppress heat conduction between the plurality of supports.