Substrate Support Unit With Thermal Shielding for Spin Actuator Reliability

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Solution Overview

Problem

In substrate treating apparatuses, the high thermal energy required for efficient etching processes poses a risk to the normal operation and longevity of the spin actuator, as it can lead to abnormal operation or failure.

Innovation Solution

A support unit is designed with a heating member, a heat insulating plate, a reflective plate, and a heat dissipation plate, which work together to efficiently heat the substrate while minimizing heat transfer to the spin actuator, thereby reducing the risk of abnormal operation or failure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If thermal energy generated by a lamp is increased to raise substrate temperature, then etching rate is improved, but the temperature of the spin actuator increases causing abnormal operation or failure

Engineering Contradiction:
Improveetching rateVSAvoidspin actuator operation
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The support plate is divided into distinct functional zones: a heating region with the lamp for substrate heating, and a cooling region with the heat dissipation plate for actuator temperature control. This spatial segmentation allows independent temperature management of different components, enabling high substrate temperature for improved etching rate while maintaining actuator temperature within safe operating limits

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heat dissipation plate is introduced as an intermediary component between the heating lamp and the spin actuator. This heat dissipation plate actively absorbs and removes heat that would otherwise transfer to the actuator, serving as a thermal buffer that protects the actuator from excessive temperature while allowing the lamp to generate sufficient thermal energy for high etching rates

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If substrate temperature is maintained at high level for extended period, then etching efficiency is improved, but energy consumption increases

Engineering Contradiction:
Improveetching efficiencyVSAvoidenergy consumption
Core Design Contradiction:
ProductivityVSUse of energy by moving object

Solution Approach 1:

The heating system is designed with spatially varying thermal properties: the substrate region receives intense heating from the lamp to maintain high temperature for efficient etching, while the actuator region is equipped with heat dissipation structures to actively remove heat. This local differentiation of thermal characteristics allows the system to maintain high substrate temperature for improved etching efficiency while minimizing energy waste through targeted heat management in different zones

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively improves the etching rate of substrates by maintaining high substrate temperatures while minimizing the risk of spin actuator failure, ensuring efficient and reliable substrate treatment processes.

Implementation Method 1

the heating member may include a lamp that emits light... the lamp may emit light having a wavelength in an infrared range

Methodology Applied
Scientific EffectInfrared radiation: Infrared Radiation

Implementation Method 2

the reflective plate is formed of a material that reflects the light having the wavelength in the infrared range

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 3

a heat insulating plate provided inside the support plate and disposed under the heating member

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 4

a heat dissipation plate provided inside the support plate and disposed under the reflective plate... the heat dissipation plate may be formed of a material having a higher thermal conductivity than the heat insulating plate

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12278121B2Support unit, substrate treating apparatus including the same, and substrate treating method
Publication Date: 2025.04.15 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12278121B2 patent drawing
  • US12278121B2 patent drawing
  • US12278121B2 patent drawing

AI summary

The inventive concept provides a support unit for supporting a substrate. The support unit includes a support plate that has an interior space and on which the substrate is placed, a heating member that is provided in the interior space and that heats the substrate placed on the support plate, a heat insulating plate provided in the interior space and disposed under the heating member, a reflective plate provided in the interior space and disposed under the heat insulating plate, and a heat dissipation plate provided in the interior space and disposed under the a reflective plate.