Substrate Support Assembly With Ultrasonic Underside Cleaning
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Solution Overview
Problem
Conventional substrate support assemblies struggle to effectively clean the underside of substrates during semiconductor fabrication processes, particularly due to limitations in using ultrasonic cleaning principles.
Innovation Solution
A substrate support assembly that includes a chuck base with a receiving recess for an ultrasonic cleaning unit, chuck pins for substrate holding, a mechanism unit for moving the chuck pins, and a driving unit for power transmission, along with a drain hole for liquid discharge, allowing for efficient ultrasonic cleaning of the substrate underside.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional substrate support assembly with a cover and skirt is used, then the substrate can be cleaned on the top surface, but the underside of the substrate cannot be effectively cleaned through ultrasonic cleaning
Solution Approach 1:
The substrate support assembly is segmented into distinct functional zones: the chuck base with receiving recess for ultrasonic cleaning, the cover with skirt for top surface cleaning, and the chuck pins for substrate holding. This segmentation allows each component to specialize in its specific cleaning function, enabling both top and underside cleaning capabilities.
Solution Approach 2:
The ultrasonic cleaning unit is nested within the receiving recess formed in the chuck base, which itself is part of the larger substrate support assembly. The receiving recess is surrounded by the installation accommodation portion, creating a nested structure that integrates the ultrasonic cleaning unit into the existing assembly without requiring a complete structural overhaul.
2Manufacturing precision
If the ultrasonic cleaning unit is disposed in the receiving recess, then uniform cleaning coverage is achieved, but the device structure becomes more complex
Solution Approach 1:
The ultrasonic cleaning unit is specifically positioned in the receiving recess at the chuck base, creating a localized cleaning zone for the substrate underside. The radial extension of the ultrasonic cleaning unit ensures uniform coverage across the substrate surface, while the local placement maintains the overall simplicity of the assembly by integrating it into the existing chuck base structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables uniform and effective cleaning of the substrate underside through controlled ultrasonic waves, with the ultrasonic cleaning unit's radial extension and adjustable position ensuring comprehensive coverage and efficient liquid dispensing, while the drain hole facilitates rapid liquid discharge, enhancing cleaning efficiency.
Implementation Method 1
an ultrasonic cleaning unit disposed in the receiving recess
Implementation Method 2
cleaning the underside of the substrate through a medium such as an ultrasonic unit
Data Source
AI summary
The present invention relates to a substrate support assembly for a substrate treatment apparatus, including: a chuck base supporting the substrate to be treated, disposed rotatable around a rotation axis, and having an installation accommodation portion formed near the outer peripheral surface thereof in a circumferential direction thereof and a receiving recess formed open on the top thereof at the inside surrounded by the installation accommodation portion; chuck pins disposed on the top of the installation accommodation portion of the chuck base and movable along directions away from and approaching the substrate; a mechanism unit disposed in the installation accommodation portion and connected to the chuck pins to move the chuck pins; a driving unit for transmitting power to the mechanism unit; and an ultrasonic cleaning unit disposed in the receiving recess.