Substrate Support Projection Layout to Prevent Wafer Sliding
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Solution Overview
Problem
Existing film forming apparatuses face challenges in suppressing substrate sliding over the substrate support, leading to increased particle occurrence due to inadequate frictional forces during rotation and thermal expansion.
Innovation Solution
The apparatus incorporates a recess in the substrate support with a projection along its outer periphery, forming a film with a high coefficient of friction to prevent substrate sliding and particle occurrence, by enhancing gas flow and frictional contact between the substrate and the support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional substrate support without projections is used, then the device complexity is low, but substrate sliding occurs due to insufficient frictional force
Solution Approach 1:
The substrate support surface is modified with projections at specific locations (along the outer periphery of the substrate) rather than uniformly across the entire surface. This localized modification increases friction only where needed to prevent sliding, while maintaining simplicity in other areas of the substrate support.
Solution Approach 2:
A film with high frictional properties is formed on the projections before substrate processing begins. This preliminary film formation creates the necessary frictional force to prevent substrate sliding during subsequent processing operations, addressing the sliding issue before it occurs.
2Productivity
If substrate rotation speed is increased to improve processing efficiency, then productivity increases, but substrate sliding worsens due to reduced frictional contact time
Solution Approach 1:
The frictional properties of the substrate support surface are changed by forming a film with specifically engineered friction characteristics on the projections. This parameter change in surface friction allows the substrate to remain stable even at higher rotation speeds, decoupling productivity improvement from sliding deterioration.
3Object-generated harmful factors
If the substrate support surface is made smoother to reduce particle generation, then manufacturing precision improves, but frictional force decreases leading to increased substrate sliding
Solution Approach 1:
The substrate support surface is designed with dual characteristics: smooth areas (without projections) to minimize particle generation, and localized projection areas to provide friction for sliding suppression. This spatial differentiation of surface quality allows simultaneous achievement of low particle occurrence and effective sliding prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces substrate sliding and particle occurrence, maintaining low substrate sliding percentages and particle adherence even at higher cumulative film thicknesses, thereby improving processing stability and efficiency.
Implementation Method 1
The apparatus incorporates a recess in the substrate support with a projection along its outer periphery, forming a film with a high coefficient of friction to prevent substrate sliding
Implementation Method 2
enhancing gas flow and frictional contact between the substrate and the support
Data Source
AI summary
A film forming apparatus includes a processing chamber and a substrate support provided in the processing chamber. The substrate support includes a recess in which a substrate is placed. The recess includes a projection at a bottom surface thereof. The projection is provided along an outer periphery of the substrate placed in the recess.