Substrate Support Temperature Balancing to Prevent Warpage
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Solution Overview
Problem
The warpage of substrate supports due to bonding materials with different thermal expansion coefficients poses a challenge during temperature control in semiconductor testing, leading to inconsistent contact between probes and substrates, affecting test quality.
Innovation Solution
A substrate support system featuring a top plate made of silicon carbide and a channel-forming member made of glass, bonded using epoxy resin, with a transparent heater to adjust the temperature of the channel-forming member, preventing warpage by controlling the thermal expansion mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If members made of materials with different thermal expansion coefficients are bonded together to form a substrate support, then the substrate support can be constructed with functional differentiation (light transmission, structural support), but warpage occurs during temperature changes due to thermal expansion mismatch
Solution Approach 1:
The patent applies the thermal expansion principle by introducing a temperature adjustment part that selectively heats the channel-forming member to control its thermal expansion. By adjusting the temperature of the channel-forming member independently, the patent compensates for the thermal expansion mismatch between the top plate portion and channel-forming member, preventing warpage during temperature changes while maintaining the functional benefits of using different materials.
2Temperature
If a refrigerant channel is formed between the top plate portion and channel-forming member for cooling, then temperature control capability is improved, but the structural integrity and dimensional stability during bonding and operation become compromised due to thermal stress
Solution Approach 1:
The patent applies parameter changes by independently controlling the temperature of the channel-forming member through the temperature adjustment part. By changing the temperature parameter of the channel-forming member selectively, the patent maintains dimensional stability and prevents warpage while preserving the temperature control capability provided by the refrigerant channel system.
3Use of energy by moving object
If light-emitting elements are used to heat the substrate, then localized temperature control is improved, but the channel-forming member may absorb or block light, reducing heating efficiency
Solution Approach 1:
The patent applies local quality by making the channel-forming member transparent to the wavelength of light emitted by the light-emitting elements. This allows light to pass through the channel-forming member and reach the substrate for localized heating, while the temperature adjustment part provides selective heating of the channel-forming member where needed, minimizing energy loss and maintaining heating efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively maintains uniform contact between probes and substrates across varying temperatures, ensuring accurate electrical characteristic testing and extending the usable temperature range of the substrate support.
Implementation Method 1
a light irradiation mechanism which includes a plurality of light-emitting elements, is disposed to face the substrate placed on the top plate portion, and heats the substrate using light emitted from the light-emitting elements
Implementation Method 2
a channel-forming member which transmits the light emitted from the light-emitting elements
Implementation Method 3
refrigerant channels are formed between the channel-forming member and the top plate portion
Implementation Method 4
a refrigerant which transmits the light emitted from the light-emitting elements flows through the refrigerant channels
Implementation Method 5
a temperature adjustment part for adjusting a temperature of the channel-forming member by using light having a wavelength absorbed by a light-transmitting material or the channel-forming member
Implementation Method 6
The substrate support includes a top plate portion 120, a channel-forming member 130, and a temperature adjustment part 150. The channel-forming member and the top plate portion are bonded using epoxy resin
Data Source
AI summary
A substrate support includes a top plate portion having a surface on which a substrate is placed; a light irradiation mechanism including light-emitting elements, disposed to face the substrate and heating the substrate using light from the light-emitting elements; a channel-forming member transmitting the light from the light-emitting elements and is bonded to a rear surface of the top plate portion so as to be interposed between the top plate portion and the light irradiation mechanism, and a temperature adjustment part for adjusting a temperature of the channel-forming member by using light having a wavelength absorbed by a light-transmitting material or the channel-forming member. Refrigerant channels are formed between the channel-forming member and the top plate portion, a refrigerant transmitting the light from the light-emitting elements flows through the refrigerant channels, and the top plate portion and the channel-forming member are made of materials having different thermal expansion coefficients.