Substrate Support Unit With Edge Grooves for Warpage Control
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Solution Overview
Problem
The warpage of substrates during semiconductor manufacturing processes leads to non-uniform treatment of liquids due to uneven pressure distribution and external airflow, causing process defects and coating inconsistencies.
Innovation Solution
A support unit with a central vacuum hole and edge grooves or slits that minimize airflow interference and pressure deviations, featuring a decompression space and airflow trapping design to stabilize the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is seated on the support unit in a vacuum adsorption method, then the substrate is fixed on the support unit, but the intensity of negative pressure is relatively large at the center and relatively small at the edge, causing non-uniform adsorption and strengthening substrate warpage
Solution Approach 1:
The support unit is divided into a central portion and an edge portion with distinct functions. The central portion contains vacuum holes for adsorption, while the edge portion provides support and airflow management, creating segmented pressure zones that achieve uniform substrate fixation without exacerbating warpage
Solution Approach 2:
Different regions of the support unit are given different properties: the central portion has vacuum holes for strong adsorption, while the edge portion has a different structure to provide milder support. This local differentiation ensures uniform pressure distribution across the substrate surface, maintaining substrate flatness during fixation
2Ease of operation
If the edge region of the substrate is spaced apart from the support unit body, then external airflow is introduced into the space, but this causes pressure deviation between center and edge portions, strengthening substrate warpage
Solution Approach 1:
The edge portion acts as an intermediary structure between the substrate and the external environment. It manages airflow introduction while providing mechanical support, preventing direct harmful airflow contact with the substrate center and maintaining pressure equilibrium across the substrate surface
3Manufacturing precision
If uniform liquid coating is required on the substrate, then substrate flatness must be maintained, but vacuum adsorption causes pressure variation between center and edge
Solution Approach 1:
The support unit structure is segmented into central vacuum holes for adsorption and edge support portions for pressure balancing. This segmentation creates a pressure distribution that maintains substrate flatness, enabling uniform liquid coating while still providing effective vacuum fixation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances uniform liquid treatment by reducing airflow influence and pressure variations, minimizing substrate warpage and improving process efficiency.
Implementation Method 1
When the support unit adsorbs and fixes the substrate in a vacuum adsorption method, the intensity of the negative pressure is relatively large at the center of the support unit
Data Source
AI summary
The present invention provides a substrate treating apparatus, including: a treatment container having a treatment space therein; a support unit for supporting and rotating the substrate in the treatment space; and a liquid supply unit for supplying a liquid onto the substrate, in which wherein the support unit includes: a body on which the substrate is seated; and a support shaft coupled to the body, and an upper surface of the body is provided with a central portion including a center of the body and an edge portion surrounding the central portion, and a vacuum hole is formed in the central portion, and a groove is formed in the edge portion.