Substrate Support Warpage Prevention via Thermal Expansion Control

The patent applies parameter changes by actively controlling the temperature of the channel-forming member using a heater. By adjusting the temperature parameter of the glass channel-forming member to match the thermal expansion characteristics of the silicon carbide top plate, the patent compensates for thermal expansion differences and prevents warpage during temperature changes, thus maintaining structural stability while using materials with different inherent thermal expansion coefficients.

The patent introduces a heater as an intermediary element between the channel-forming member and the external environment. This heater acts as a mediator that actively manages the thermal state of the glass channel-forming member, enabling precise temperature control to match thermal expansion rates with the top plate, thereby preventing warpage while allowing the use of materials with different thermal properties.

The patent applies local quality by providing multiple light-emitting elements arranged in an array across the light irradiation mechanism. Each light-emitting element independently irradiates a specific local region of the substrate, allowing for spatially distributed heating. This arrangement enables efficient heating of the entire substrate area while maintaining temperature uniformity through coordinated control of multiple localized light sources.

The light irradiation mechanism is segmented into multiple independent light-emitting elements rather than using a single light source. This segmentation allows each element to target specific regions of the substrate, enabling precise control over the heating pattern. By coordinating the operation of these segmented light sources, the system achieves both high heating efficiency and uniform temperature distribution across the substrate.