Substrate-with-support Exposing Wiring Area for Electric Testing
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Solution Overview
Problem
Substrate-with-supports with metal supports cover the entire back surface, preventing exposure of external connection pads, which hinders electric testing such as Open/Short tests.
Innovation Solution
A substrate-with-support design featuring a metal support with an outer frame and protruding portions that expose the wiring area, allowing the support joint portions to be joined with the protruding portions, enabling electric testing while maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the entire back surface of the substrate is covered with a support, then the handling strength is improved, but the external connection pads on the back surface cannot be exposed for electric testing
Solution Approach 1:
The support is divided into an outer frame portion and multiple protruding portions, with the wiring area left uncovered to expose the external connection pads. This segmentation allows the support to provide strength where needed while leaving test areas accessible.
Solution Approach 2:
The support structure provides different coverage in different areas: full coverage at the periphery for strength, and no coverage in the wiring area for pad exposure. This local differentiation resolves the contradiction between needing support for handling and needing exposed pads for testing.
2Length of stationary object
If the substrate thickness is reduced to achieve lower profile, then the profile height is improved, but the handling difficulty increases
Solution Approach 1:
The support is designed with an outer frame and discrete protruding portions rather than a continuous full-coverage structure. This segmentation allows the substrate to remain thin while providing localized strength enhancement only where structurally necessary.
Solution Approach 2:
The support provides localized reinforcement at the substrate periphery and specific mounting areas, allowing the central wiring area to remain thin and flexible for electrical connectivity while maintaining overall structural integrity for handling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables electric testing of the substrate-with-support by exposing the wiring area while providing sufficient strength for handling and assembly of semiconductor packages.
Implementation Method 1
the support joint portions and the protruding portions are joined to each other
Data Source
AI summary
A substrate-with-support includes: a substrate having a wiring area, an outer peripheral area provided on an outer peripheral side of the wiring area, and a plurality of support joint portions being provided on the outer peripheral area; and a support made of metal having an outer frame portion arranged to face the outer peripheral area and to expose the wiring area, and a plurality of protruding portions being provided on the outer frame portion, wherein the support joint portions and the protruding portions are joined to each other.