Substrate Support Wiring Routing for Temperature Uniformity
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Solution Overview
Problem
Substrate processing systems face challenges in achieving temperature uniformity due to structural limitations that prevent vias and wiring from being located close to heating elements, resulting in non-symmetrical heating patterns and temperature non-uniformities.
Innovation Solution
The substrate support system includes a plurality of heating zones with a heating layer and a ceramic layer, where electrical connections are routed through the ceramic layer to connect with heating elements, reducing the need for vias and wiring to be directly under the heating elements, thereby improving design flexibility and temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If vias and wiring are routed through the baseplate close to heating elements, then electrical connections can be made to heating elements, but structural limitations prevent close routing leading to non-symmetrical heating patterns and temperature non-uniformities
Solution Approach 1:
The patent routes electrical connections through the ceramic layer in a horizontal direction rather than vertically through the baseplate near heating elements. This dimensional change in wiring path allows connections to reach heating elements without creating exclusion zones that disrupt thermal symmetry, thereby achieving temperature uniformity while maintaining electrical connectivity.
Solution Approach 2:
The ceramic layer serves as an intermediary medium for routing electrical connections. By using the ceramic layer as a conduit for wiring, the patent enables electrical connections to heating elements without requiring vias and wiring to be routed close to heating elements through the baseplate, thus avoiding the creation of heater exclusion zones and achieving symmetrical heating patterns.
2Adaptability or versatility
If wiring is routed horizontally through the ceramic layer to heating elements, then design flexibility and temperature uniformity improve, but electrical connection routing becomes more complex
Solution Approach 1:
The patent utilizes the horizontal plane within the ceramic layer for routing electrical connections, representing a dimensional shift from traditional vertical baseplate routing. This approach provides design flexibility by allowing wiring to be routed independently of heating element positions while maintaining temperature uniformity through symmetrical connection paths.
Solution Approach 2:
The ceramic layer serves multiple functions: it provides structural support, acts as an electrical insulator, and simultaneously serves as a conduit for horizontal wiring routing. This multi-functionality enhances design flexibility by allowing the same component to fulfill multiple roles without increasing overall device complexity.
3Ease of manufacture
If vias and wiring are located close to heating elements, then electrical connections are simplified, but heater exclusion zones are created causing temperature non-uniformities
Solution Approach 1:
The ceramic layer acts as an intermediary that enables electrical connections to heating elements without requiring vias and wiring to be positioned close to the heating elements. This intermediary routing path eliminates heater exclusion zones while maintaining connection simplicity through standardized horizontal wiring paths within the ceramic layer.
Solution Approach 2:
The patent extracts the electrical connection routing function from the baseplate structure and relocates it to the ceramic layer. This separation allows heating elements to be positioned optimally for thermal symmetry without the constraint of nearby vias and wiring, thereby eliminating exclusion zones and achieving temperature uniformity while maintaining connection simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces heater exclusion zones and enhances temperature uniformity across the substrate support, allowing for more flexible placement of vias and wiring, leading to improved thermal control during substrate processing.
Implementation Method 1
A heating layer may be arranged between the ceramic layer and a baseplate of the substrate support. For example only, the heating layer may be a ceramic heating plate including heating elements, wiring, etc.
Implementation Method 2
The via is filled with a conductive material coupling the electrical connection to a connection point of the heating element
Data Source
AI summary
A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, a heating layer arranged on the baseplate, a ceramic layer arranged on the heating layer, and wiring provided through the baseplate, the heating layer, and into the ceramic layer in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone, across the ceramic layer to a second zone of the plurality of heating zones, and to a heating element in the heating layer in the second zone.