Plasma Resistant Protective Layer for Substrate Support Assembly
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Solution Overview
Problem
In the semiconductor industry, substrate support assemblies exposed to plasma etch and clean processes face corrosion due to high-speed plasma streams, leading to equipment damage and increased maintenance and manufacturing costs.
Innovation Solution
A substrate support assembly with a ceramic body and a thermally conductive base, featuring a protective layer of yttrium aluminum garnet (YAG) or a ceramic compound like Y4Al2O9 and a solid-solution of Y2O3—ZrO2, applied via ion assisted deposition or plasma spraying, providing plasma corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrate support assembly is exposed to plasma etch and clean processes, then manufacturing capability is maintained, but corrosion damage occurs and service life decreases
Solution Approach 1:
The patent applies a composite protective coating system consisting of multiple layers: a first protective coating (e.g., alumina) and a second protective coating (e.g., yttria-stabilized zirconia or yttrium aluminum garnet) with different plasma resistance properties. This multi-layer composite structure provides superior corrosion resistance compared to single-material coatings, allowing the substrate support assembly to maintain manufacturing capability while extending service life in plasma environments.
2Reliability
If protective layer is applied to ceramic body, then plasma corrosion resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary surface preparation steps including roughening the ceramic body surface before applying the protective coatings. This preliminary action enhances coating adhesion and ensures uniform coverage, reducing the need for complex post-processing or additional layers. The method also includes preliminary heating to controlled temperatures during coating application, which simplifies the overall manufacturing process by preventing defects that would require rework.
Solution Approach 2:
The patent replaces complex mechanical bonding methods with thermal field-assisted coating application. By controlling the temperature field during the coating process, the protective layers are applied more uniformly and adhere better to the ceramic substrate, reducing manufacturing complexity compared to traditional mechanical or chemical bonding methods.
3Productivity
If high-speed plasma stream is used for etching, then processing efficiency is improved, but corrosive damage to components increases
Solution Approach 1:
The patent introduces a protective coating layer as an intermediary barrier between the high-speed plasma stream and the substrate support assembly components. This intermediary layer (composed of plasma-resistant materials like yttria-stabilized zirconia or yttrium aluminum garnet) allows the high-speed plasma to maintain its etching efficiency while preventing direct contact with and corrosion of the underlying ceramic and metal components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer enhances the service life of substrate support assemblies, reduces maintenance and manufacturing costs, and maintains the structural integrity of components exposed to plasma processes.
Implementation Method 1
the protective layer is deposited on the upper surface of the ceramic body via ion assisted deposition (IAD) or plasma spraying
Implementation Method 2
the protective layer is deposited on the upper surface of the ceramic body via ion assisted deposition (IAD) or plasma spraying
Implementation Method 3
the protective layer is a bulk sintered ceramic body that is diffusion bonded to the ceramic body via a heat treatment
Data Source
AI summary
A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support assembly further comprises a protective layer covering an upper surface of the ceramic body, wherein the protective layer comprises at least one of yttrium aluminum garnet (YAG) or a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.