Substrate Supporting Apparatus Thermal Expansion Alignment
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Solution Overview
Problem
In substrate processing, thermal expansion mismatches between the upper and lower walls of a chamber and between the upper and lower portions of a reactor lead to misalignment of the substrate supporting apparatus, resulting in uneven thin film uniformity and increased defect rates in semiconductor devices.
Innovation Solution
A substrate processing method that involves moving the substrate supporting apparatus in specific directions to center it with respect to a ring, maintaining a constant gap, and using an alignment device and controller to adjust the position, ensuring the ring is slidable and movable to maintain pressure balance and thermal equilibrium.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the chamber and reactor are heated to high temperature for substrate processing, then the processing capability is improved, but thermal expansion mismatch causes misalignment of the substrate supporting apparatus
Solution Approach 1:
The substrate supporting apparatus is designed with movable components including a movable lower body and adjustable positioning mechanisms. This allows the apparatus to dynamically adjust its position and maintain proper centering alignment even as thermal expansion occurs during high-temperature processing, resolving the contradiction between operating temperature and alignment precision
Solution Approach 2:
The system changes physical parameters by adjusting the position of the lower body and substrate supporting apparatus in response to thermal conditions. By monitoring and adjusting positional parameters during heating, the system maintains proper alignment despite thermal expansion mismatch between chamber components
2Temperature
If the upper wall is heated to maintain higher temperature than the lower wall, then the gas supply heating is improved, but the thermal expansion difference between upper and lower walls causes reactor mismatch
Solution Approach 1:
The lower body and substrate supporting apparatus are designed as movable components that can dynamically adjust their positions. This dynamic capability allows the system to compensate for the thermal expansion difference between the heated upper wall and the cooler lower wall, maintaining proper reactor geometry and component matching throughout the temperature gradient
Solution Approach 2:
The system performs preliminary positioning adjustments before and during heating to pre-compensate for expected thermal expansion. By adjusting the lower body position in advance and continuously monitoring alignment, the system prevents reactor mismatch from developing as the temperature gradient is established
3Manufacturing precision
If the substrate supporting apparatus is moved to correct thermal expansion mismatch, then the centering alignment is improved, but the complexity of the positioning system increases
Solution Approach 1:
Rather than adding complex rigid adjustment mechanisms, the system utilizes the inherent mobility of the lower body and substrate supporting apparatus. The positioning is achieved through controlled movement of existing movable components rather than adding new complex mechanisms, thereby maintaining simplicity while improving alignment precision
Solution Approach 2:
The movable lower body and substrate supporting apparatus essentially self-adjust through controlled movement in response to thermal conditions. The system uses its own movable components to correct alignment issues without requiring external complex positioning equipment, allowing the apparatus to service its own alignment needs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves thin film uniformity by correcting thermal expansion mismatches, reducing defect rates, and maintaining consistent gas flow, thereby enhancing the reproducibility of the substrate processing process.
Implementation Method 1
thermal expansion mismatches between the upper and lower walls of a chamber and between the upper and lower portions of a reactor lead to misalignment of the substrate supporting apparatus
Data Source
AI summary
A substrate processing method capable of improving thin film uniformity on a substrate by controlling the position of a substrate supporting apparatus includes: a first operation of moving the substrate supporting apparatus in a first direction by a first predetermined distance; a second operation of moving the substrate supporting apparatus in a second direction by a second predetermined distance; a third operation of moving the substrate supporting apparatus in the second direction by the first predetermined distance; and a fourth operation of moving the substrate supporting apparatus in the first direction by the second predetermined distance, wherein the second direction may be opposite to the first direction.