Substrate Surface Modification for Pattern Collapse Prevention
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Solution Overview
Problem
Recent research has shown that pattern collapse and increased particle presence occur during substrate processing, even with hydrophobization processes, due to surface unevenness caused by oxides, which leads to inadequate drying and hydrophobic film formation.
Innovation Solution
A substrate processing method that includes surface modification to improve roughness, followed by cleaning and hydrophobization, either through thermal modification to remove oxides or chemical cleaning to planarize the surface, ensuring a uniform and low-roughness hydrophobic surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If water is used as rinse liquid, then rinsing effectiveness is improved, but surface tension acts on the pattern causing collapse
Solution Approach 1:
The patent introduces an intermediary substance (hydrophobizing agent) that modifies the substrate surface to repel water. This mediator prevents water from directly contacting and exerting surface tension on the pattern, thereby resolving the contradiction between effective rinsing and pattern strength protection
Solution Approach 2:
The patent changes the surface energy parameter of the substrate by applying a hydrophobizing agent. This parameter change creates a hydrophobic surface that prevents water adhesion and surface tension effects on the pattern, while still allowing effective rinsing
2Strength
If hydrophobization process is performed, then pattern collapse is prevented, but particles are generated on the substrate surface
Solution Approach 1:
The patent performs preliminary cleaning of the substrate surface before hydrophobization to remove particles and contaminants. This preliminary action ensures that the subsequent hydrophobizing agent application does not generate or leave particles on the surface, resolving the contradiction between pattern protection and surface cleanliness
3Reliability
If oxide is present on the substrate surface, then surface unevenness occurs, but hydrophobization cannot be uniformly performed
Solution Approach 1:
The patent performs preliminary oxide removal or surface planarization before hydrophobization. This preliminary action creates a uniform surface that allows the hydrophobizing agent to form an even film, resolving the contradiction between reliable hydrophobic film formation and surface flatness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents pattern collapse and particle formation by creating a uniformly hydrophobic and flat substrate surface, enhancing hydrophobicity and reducing surface roughness.
Implementation Method 1
a thermal modification step of heating a substrate having an oxide on a surface thereof to modify the surface
Implementation Method 2
a surface cleaning step of supplying a treatment liquid to the modified surface of the substrate to clean the surface of the substrate with the treatment liquid
Implementation Method 3
a hydrophobization step of supplying a hydrophobizing agent to the cleaned surface of the substrate to hydrophobize the surface of the substrate
Data Source
AI summary
A substrate processing method and a substrate processing apparatus are provided, which solve problems of pattern collapse and particles. The substrate processing method includes: a surface modification step of modifying a surface of a substrate having an oxide thereon to improve or reduce roughness of the surface; a surface cleaning step of supplying a treatment liquid to the modified surface of the substrate to clean the surface of the substrate with the treatment liquid; and a hydrophobization step of supplying a hydrophobizing agent to the cleaned surface of the substrate to hydrophobize the surface of the substrate.