Substrate Surface Conditioning for Selective Uniform Film Growth

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Solution Overview

Problem

Existing methods face challenges in selectively growing a film on a specific surface of a substrate due to varying surface conditions.

Innovation Solution

A method involving the sequential supply of a fluorine-containing gas, an oxygen- and hydrogen-containing gas, a catalyst, and a modifying agent to a substrate, followed by a film-forming agent, to facilitate selective film formation on a desired surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If selective growth is performed on a substrate with varying surface conditions, then film formation on a specific surface is desired, but uniform and selective film growth cannot be achieved due to inconsistent surface states

Engineering Contradiction:
Improveselectivity of film formationVSAvoiduniformity of film growth
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies parameter changes by systematically modifying the chemical state of substrate surfaces through controlled exposure to fluorine-containing gas, oxygen-containing gas, and hydrogen-containing gas. These gas treatments alter surface chemistry parameters (such as surface energy, hydrophobicity, and chemical composition) to create distinct surface states that enable selective and uniform film growth on specific regions

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements preliminary action by performing a sequence of surface preparation steps before the actual selective growth process. The substrate undergoes fluorine treatment, oxygen treatment, and hydrogen treatment in advance to pre-condition the surfaces, ensuring that when the selective growth is performed, the surfaces are already in the optimal state for uniform film formation

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective and selective film formation on the target surface by modifying the substrate surface conditions, enhancing the adsorption of the film-forming agent and promoting uniform film growth.

Implementation Method 1

supplying a fluorine-containing gas to a substrate including a first surface and a second surface

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

supplying an oxygen- and hydrogen-containing gas to the substrate after performing (a)

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 3

supplying an oxygen- and hydrogen-containing gas to the substrate after performing (a)

Methodology Applied
Scientific EffectHydrogenation: Hydrogenation

Implementation Method 4

supplying an oxygen- and hydrogen-containing gas and a catalyst to the substrate after performing (a)

Methodology Applied
Scientific EffectCatalysis: Catalysis

Implementation Method 5

supplying a modifying agent to the substrate after performing (b)

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 6

supplying a film-forming agent to the substrate after performing (c)

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Data Source

PatentUS12581878B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
Publication Date: 2026.03.17 KOKUSAI DENKI KK
  • US12581878B2 patent drawing
  • US12581878B2 patent drawing
  • US12581878B2 patent drawing

AI summary

There is provided a technique that includes (a) supplying a fluorine-containing gas to a substrate including a first surface and a second surface; (b) supplying an oxygen- and hydrogen-containing gas and a catalyst to the substrate after performing (a); (c) supplying a modifying agent to the substrate after performing (b); and (d) supplying a film-forming agent to the substrate after performing (c).