Substrate Mounting Table Repositioning for Faster Chamber Cooling
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Solution Overview
Problem
High-temperature cleaning processing after semiconductor substrate processing can lead to defects due to the difficulty in efficiently cooling the process chamber from the high processing temperature to a lower cleaning temperature, which may take time and risk peeling off deposited films.
Innovation Solution
A substrate processing apparatus with a vertically movable susceptor, a cooling gas supply system, a cleaning gas supply system, and an exhaust system, controlled by a controller to efficiently cool the process chamber by moving the susceptor to a lower position, increasing the volume for cooling gas supply, and regulating pressure to enhance cooling efficiency while preventing film peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If cooling gas is supplied into the process chamber while the substrate mounting table remains in the process region, then the cooling process is simple to operate, but the cooling efficiency is insufficient and cooling time is prolonged
Solution Approach 1:
The substrate mounting table is made vertically movable between the process region and transfer region, allowing dynamic repositioning during the cooling process. This enables the system to optimize cooling efficiency by moving the table to the transfer region where cooling gas can flow more effectively, while maintaining ease of operation through automated control sequences.
Solution Approach 2:
The solution introduces a vertical dimension to the cooling process by moving the substrate mounting table between different vertical positions (process region and transfer region). This spatial repositioning creates better gas flow paths and enhances cooling efficiency without complicating the operational interface, as the movement is automatically managed.
2Loss of time
If the substrate mounting table is moved below the process region to improve cooling efficiency, then cooling time is reduced, but the device complexity increases
Solution Approach 1:
The substrate mounting table serves multiple functions: it holds substrates during processing, enables substrate transfer between chambers, and acts as a movable platform for optimized cooling. By combining these functions into a single vertically movable unit, the system reduces cooling time without proportionally increasing overall device complexity.
Solution Approach 2:
The controller automatically manages the vertical movement of the substrate mounting table and coordinates gas supply timing, making the system self-regulating. This automation handles the complexity internally while presenting a simple operational interface, reducing cooling time without requiring additional manual intervention or complex external control systems.
3Reliability
If cleaning processing is performed at high temperature to remove deposits effectively, then cleaning capability is improved, but defects occur due to film peeling
Solution Approach 1:
The system performs preliminary cooling of the process chamber before initiating the cleaning process. By pre-cooling the chamber to a safe temperature range, the system prevents film peeling during cleaning while maintaining effective cleaning capability. This preliminary temperature adjustment eliminates the harmful thermal effect before the cleaning action begins.
Solution Approach 2:
The system changes the temperature parameter from high processing temperature to lower cleaning temperature before performing cleaning operations. This parameter adjustment ensures that the cleaning process operates at a temperature safe for deposited films, preventing peeling defects while maintaining adequate cleaning effectiveness through optimized gas flow and timing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently cools the process chamber, reducing cooling time and preventing film peeling, thereby enabling safe and effective cleaning at a lower temperature, preventing defects and ensuring reliable substrate processing.
Implementation Method 1
supplying the cooling gas into the process chamber
Implementation Method 2
a substrate mounting table that is vertically movable and in which a heating mechanism is incorporated
Data Source
AI summary
There is provided a technique that includes: a substrate mounting table vertically movable and incorporating a heating mechanism; a process chamber divided by the substrate mounting table into a process region where a substrate is processed and a transfer region where transfer of the substrate is performed; a cooling gas supply system that supplies a cooling gas into the process chamber; a cleaning gas supply system that supplies a cleaning gas into the process chamber; an exhaust system that exhausts the process chamber; a controller capable of controlling the substrate mounting table, the cooling gas supply system, the cleaning gas supply system, and the exhaust system to perform: supplying the cooling gas into the process chamber in a state where the substrate mounting table is moved below the process region; and supplying the cleaning gas into the process chamber at a temperature lower than a temperature during substrate processing.