Substrate Table Cleaning Pad With Controlled Abrasion
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Solution Overview
Problem
In photolithography processes, contamination on the substrate table surfaces leads to improper light focusing, affecting the accuracy of pattern transfer onto semiconductor wafers, as contaminants prevent the substrate from lying flat, causing defects in semiconductor device fabrication.
Innovation Solution
A portable handheld cleaning device with adjustable weight members and a cleaning pad with pyramid-shaped structures is used to efficiently remove contaminants from the substrate table, ensuring even pressure distribution and effective cleaning without damaging the surface, along with an automated cleaning device equipped with feedback circuitry to monitor and adjust cleaning speeds and pressures for precise contamination removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning device applies pressure to remove contaminants, then cleaning effectiveness is improved, but the substrate table surface may be damaged
Solution Approach 1:
The cleaning device uses adjustable weight members to precisely control and change the pressure parameter applied to the substrate table surface. This allows optimization of cleaning effectiveness while preventing surface damage by maintaining pressure within safe limits.
Solution Approach 2:
The patent replaces aggressive mechanical scraping with a softer cleaning pad that uses controlled friction and abrasion. The pyramid-shaped structures on the pad provide gentle mechanical action that removes contaminants without damaging the surface.
2Device complexity
If manual cleaning is used, then device complexity is reduced, but cleaning precision and consistency deteriorate
Solution Approach 1:
The cleaning device is designed to be self-regulating through its weight distribution system. The adjustable weights automatically provide consistent pressure distribution across the cleaning pad as it moves over the substrate table, ensuring uniform cleaning without requiring complex active control systems.
3Manufacturing precision
If automated cleaning with feedback circuitry is used, then cleaning precision is improved, but device complexity increases
Solution Approach 1:
The automated cleaning device incorporates feedback circuitry that monitors cleaning effectiveness in real-time and adjusts operating parameters accordingly. This feedback mechanism enables precise contaminant removal while maintaining manageable system complexity through intelligent control.
4Productivity
If pyramid-shaped cleaning structures are used, then contaminant removal efficiency is improved, but surface damage risk increases
Solution Approach 1:
The pyramid-shaped structures on the cleaning pad have controlled dimensions and spacing parameters that optimize cleaning efficiency while minimizing surface damage risk. The geometry parameters are specifically designed to remove contaminants effectively without creating scratches on the substrate table surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures accurate light focusing and pattern transfer, reducing defects in semiconductor fabrication by effectively cleaning substrate table surfaces, resulting in cost savings and improved process reliability.
Implementation Method 1
A portable handheld cleaning device with adjustable weight members and a cleaning pad with pyramid-shaped structures is used to efficiently remove contaminants from the substrate table
Implementation Method 2
A portable handheld cleaning device with adjustable weight members and a cleaning pad with pyramid-shaped structures is used to efficiently remove contaminants from the substrate table
Data Source
AI summary
A portable handheld cleaning device is provided capable of cleaning the surface of the substrate table without damaging the surface. The portable handheld cleaning device in accordance with the present disclosure includes a base having a first side and a second side (the first side and the second side overlapping each other), a hollow structure on the first side of the base, and a weight holding space within the hollow structure. A grinding pad is provided on the second side of the base. The grinding pad includes a cleaning surface, the cleaning surface having a plurality of substantial pyramid shaped grits.