Substrate Mounting Table Temperature Control via Refrigerant Flow
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Solution Overview
Problem
Existing substrate processing technologies face challenges in efficiently adjusting the temperature of a substrate mounting table, leading to prolonged throughput due to slow temperature rising and dropping times, which limits the performance of multiple processes requiring different temperatures in a single process container.
Innovation Solution
A method and apparatus that utilize a refrigerant passage and a heater in the substrate mounting table, with controlled refrigerant flow rates and heater operation to rapidly adjust the temperature, allowing the substrate mounting table to be set to different temperatures by adjusting the refrigerant flow rate and heater output, thereby reducing temperature adjustment times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If refrigerant flow rate is increased to shorten temperature dropping time, then temperature adjustment speed improves, but chiller temperature stability deteriorates
Solution Approach 1:
The system dynamically adjusts the refrigerant flow rate based on the temperature adjustment direction. When lowering substrate mounting table temperature, the refrigerant flow rate is increased to accelerate cooling. When raising temperature, the refrigerant flow rate is decreased or stopped to allow heater operation. This dynamic flow rate control optimizes temperature adjustment speed while maintaining chiller stability through coordinated heater control.
Solution Approach 2:
The invention changes the operating parameters of the refrigerant circulation system by adjusting the flow rate according to temperature control needs. The flow rate is varied between a first flow rate (for maintaining chiller temperature) and a second flow rate (for rapid temperature dropping), allowing the system to adapt to different operational requirements and resolve the contradiction between speed and stability.
2Loss of time
If heater operation is intensified to shorten temperature rising time, then temperature adjustment speed improves, but energy consumption increases
Solution Approach 1:
The system performs preliminary action by pre-cooling the substrate mounting table to the lower temperature before the temperature rise is needed. This reduces the temperature differential that the heater must overcome, thereby shortening the temperature rising time without requiring excessive heater power or energy consumption during the heating phase.
Solution Approach 2:
The invention employs periodic alternation between cooling-dominated and heating-dominated phases. During cooling phases, refrigerant flow is maximized to lower the temperature. During heating phases, refrigerant flow is reduced and heater is activated. This periodic switching optimizes the overall temperature adjustment cycle efficiency, balancing speed and energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly shortens the temperature rising and dropping times, enhancing the throughput by allowing multiple processes with different temperature requirements to be performed efficiently in a single process container, thereby simplifying the processing facility and reducing costs.
Implementation Method 1
a substrate mounting table arranged in a process container and including a refrigerant passage through which a refrigerant flows
Implementation Method 2
adjusting the temperature of the substrate mounting table to a first temperature... by allowing the refrigerant at a second flow rate larger than the first flow rate to flow from the chiller to the refrigerant passage
Implementation Method 3
a heater embedded therein... the heater is operated so that the temperature of the substrate mounting table becomes the second temperature
Implementation Method 4
raises the temperature of the substrate mounting table by causing the heater to generate heat
Implementation Method 5
a chiller configured to circulate the refrigerant with the refrigerant passage
Implementation Method 6
the refrigerant at a first flow rate for maintaining a set temperature of the chiller is allowed to flow from the chiller to the refrigerant passage
Data Source
AI summary
There is provided a method of processing a substrate by a substrate processing apparatus including a substrate mounting table having a refrigerant passage and a heater, and a chiller. The method includes adjusting a temperature of the substrate mounting table to a first temperature to process the substrate; and adjusting the temperature of the substrate mounting table to a second temperature higher than the first temperature to process the substrate. The temperature of the substrate mounting table becomes the second temperature by allowing the refrigerant at a first flow rate to flow from the chiller to the refrigerant passage and operating the heater. The temperature of the substrate mounting table becomes the first temperature by allowing the refrigerant at a second flow rate larger than the first flow rate to flow from the chiller to the refrigerant passage and operating the heater, or stopping an operation of the heater.