Substrate Tank Inner-Wall Flow Separation for Uniform Wet Processing
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Solution Overview
Problem
Existing substrate processing apparatuses struggle to uniformly circulate and distribute processing solutions, such as etching solutions, across the entire surface of semiconductor substrates, leading to non-uniform processing and accumulation of reaction products.
Innovation Solution
The apparatus incorporates an inner wall in the processing tank to separate downward and upward flows of the processing solution, using nozzles to create uniform upward flows over the substrate surfaces, and optionally includes a bubble nozzle to promote bubbling, ensuring consistent solution distribution and preventing stagnation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional processing tank without flow separation is used, then the structure is simple, but the processing solution flow becomes non-uniform across substrate surfaces
Solution Approach 1:
The processing tank is segmented into a first region and a second region by a partition wall, separating the downward flow path from the upward flow path. This segmentation allows independent control of flow patterns in each region, enabling uniform processing solution distribution across substrate surfaces while maintaining a relatively simple overall structure.
Solution Approach 2:
A circulation promotion mechanism acts as an intermediary component between the first region and second region, facilitating controlled fluid circulation. This intermediary mechanism helps regulate the processing solution flow to achieve uniform distribution without requiring complete redesign of the processing tank structure.
2Manufacturing precision
If processing solution flow is increased to improve uniformity, then processing uniformity improves, but reaction product accumulation increases in certain regions
Solution Approach 1:
By dividing the processing tank into separate regions with distinct flow patterns, the system prevents reaction products generated in high-flow areas from accumulating in low-flow areas. The partition wall creates independent circulation zones that manage reaction product distribution effectively.
Solution Approach 2:
The circulation promotion mechanism dynamically adjusts fluid circulation between regions, adapting flow patterns to prevent reaction product accumulation. This dynamic control maintains processing uniformity while actively managing harmful byproduct distribution.
3Device complexity
If downward and upward flows are allowed to mix freely, then the flow system is simple, but processing uniformity deteriorates due to flow interference
Solution Approach 1:
The partition wall physically segments the processing tank into distinct flow regions, preventing direct mixing of downward and upward flows. This segmentation maintains simple flow control mechanisms while achieving superior processing uniformity through controlled flow separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves uniform processing of substrate surfaces by maintaining consistent flow rates and reducing reaction product accumulation, resulting in efficient and uniform treatment of substrates.
Implementation Method 1
opening in a manner as to cause an upward flow of the processing solution to be formed inside the inner wall
Implementation Method 2
optionally includes a bubble nozzle to promote bubbling
Data Source
AI summary
A substrate processing apparatus of an embodiment includes: a processing tank that stores a processing solution and houses a plurality of substrates that are to be processed with the processing solution, with the substrates being arranged in a predetermined direction; an inner wall provided in the processing tank to cover at least a partial portion of a substrate surface located at one end in terms of the arrangement direction of the substrates and at least partial portions of side surfaces, of the substrates, that line up along the arrangement direction, with a space where the processing solution flows being present between the inner wall and a bottom surface of the processing tank; and a processing solution nozzle provided at a position that is in the processing tank and outside the inner wall and opening in a manner to cause an upward flow to be formed inside the inner wall.