Substrate Processing Tank Heating and Nozzle Zoning for Uniform Etching
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Solution Overview
Problem
Existing substrate processing apparatuses fail to achieve uniform processing, particularly in terms of etching uniformity across the principal surface of substrates due to temperature and liquid distribution inconsistencies.
Innovation Solution
A substrate processing apparatus with individually controlled processing liquid discharge and heating mechanisms, utilizing multiple nozzles and heaters to ensure even application and temperature distribution across the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single heating device and single processing liquid supply method are used, then the device complexity is reduced, but the uniformity of processing across the substrate surface deteriorates
Solution Approach 1:
The heating device is divided into multiple independent heating elements (first heating device and second heating device) positioned at different locations within the processing chamber. Similarly, the processing liquid supply system is segmented into multiple nozzles (first processing liquid nozzle and second processing liquid nozzle) that discharge liquid at different positions. This segmentation allows independent control of heating and liquid supply at various zones, enabling uniform processing across the entire substrate surface without requiring excessive complexity in any single component.
Solution Approach 2:
Different regions of the processing chamber are provided with locally optimized heating and liquid supply characteristics. The first heating device and first nozzle serve one region while the second heating device and second nozzle serve another region. This local quality approach ensures that each area of the substrate receives appropriate heating and processing liquid discharge, achieving overall uniformity through localized optimization rather than relying on a single complex system.
2Manufacturing precision
If processing liquid is discharged from a single position, then the control system is simplified, but the evenness of processing liquid application across the substrate deteriorates
Solution Approach 1:
The processing liquid supply system is divided into multiple nozzles positioned at different locations within the processing chamber. Each nozzle is controlled independently to discharge processing liquid at its specific position. This segmentation of the supply system allows the processing liquid to be applied evenly across different areas of the substrate, achieving uniformity in liquid application without requiring an overly complex control system.
Solution Approach 2:
The processing liquid is discharged not only from above the substrate but also from side positions within the processing chamber. This multi-dimensional discharge approach ensures that processing liquid reaches all areas of the substrate uniformly, including edge regions, by utilizing spatial distribution in multiple dimensions rather than relying on a single centralized discharge point.
3Temperature
If the wall temperature distribution is non-uniform, then the heating system is simpler, but the temperature distribution of processing liquid across the substrate deteriorates
Solution Approach 1:
The heating system is divided into multiple independent heating devices positioned at different locations within the processing chamber. Each heating device can be controlled independently to maintain appropriate wall temperatures at its respective location. This segmentation allows the system to achieve uniform temperature distribution across the entire chamber wall, which in turn ensures uniform temperature of the processing liquid across the substrate surface without requiring a single complex heating system.
Solution Approach 2:
Different regions of the processing chamber wall are heated by locally positioned heating devices. The first heating device maintains temperature at its location while the second heating device maintains temperature at a different location. This local quality approach ensures that each area of the wall, and consequently the processing liquid in contact with it, achieves the required temperature uniformity through localized heating control rather than relying on a single complex heating system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves improved uniformity of processing by ensuring even application and temperature distribution, enhancing the consistency of processing results on substrates.
Implementation Method 1
a rubber heater is bonded to a wall of the storage tank. The rubber heater heats the wall of the storage tank, thereby heating the processing liquid inside the storage tank to a predetermined temperature
Implementation Method 2
The processing liquid is suctioned from the processing liquid outlet of the overflow tank by the processing liquid circulation portion, and the processing liquid is supplied to the processing liquid inlet/outlet of the storage tank, whereby the processing liquid is circulated
Data Source
AI summary
A substrate processing apparatus includes a processing tank including a wall defining an internal space to store a processing liquid, a lifter to hold a substrate and immerse the substrate in the processing liquid, a plurality of processing liquid nozzles to discharge the processing liquid into the internal space of the processing tank from a plurality of respective different positions in the processing tank, a heating device including a plurality of heaters to respectively heat a plurality of different regions of the wall, and a controller to individually control discharge of the processing liquid from the plurality of processing liquid nozzles and individually control outputs of the plurality of heaters. The controller may individually control the outputs of the plurality of heaters according to a discharge state of the processing liquid from the plurality of processing liquid nozzles.