Substrate Tank Rectifying Flow for Uniform Liquid Processing
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Solution Overview
Problem
Existing substrate liquid processing apparatuses face challenges in maintaining in-plane uniformity during liquid processing due to disturbances in the ascending flow of processing liquids, leading to non-uniform treatment of substrates.
Innovation Solution
The apparatus incorporates a rectifying section with discharge holes, plate-shaped members, and protruding members to adjust and direct the flow of processing liquids, preventing disturbances and ensuring uniform coverage of substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a processing liquid ejection unit generates ascending flow by ejecting processing liquid into the processing tank, then liquid processing is performed on substrates, but descending flows occur in side spaces causing non-uniform processing
Solution Approach 1:
The patent extracts and removes the harmful descending flow from the side space by providing a discharge hole in the side wall of the processing tank. This allows the descending flow to be taken out and discharged externally, preventing it from disturbing the ascending flow and affecting substrate processing uniformity
Solution Approach 2:
The discharge hole acts as an intermediary element between the side space and the external environment. It provides a controlled pathway for the processing liquid to exit the side space, mediating the flow dynamics and preventing harmful descending flows from developing
2Productivity
If substrates are supported with main surfaces in vertical direction, then liquid processing is applied to multiple substrates, but flow distribution in side spaces becomes problematic
Solution Approach 1:
The discharge hole serves as an intermediary that connects the side space to the external environment, providing a controlled exit path for processing liquid. This mediator prevents the formation of harmful descending flows that would otherwise occur in the confined side space between substrates and tank walls
Solution Approach 2:
The harmful descending flow is extracted from the side space through the discharge hole and removed from the system. This extraction eliminates the source of flow disturbances that would compromise processing uniformity while maintaining high substrate throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances in-plane uniformity by suppressing descending flows and maintaining consistent ascending flows, thereby improving the processing quality and consistency across substrates.
Implementation Method 1
a processing liquid ejection unit provided below the plurality of substrates supported by the substrate support, and configured to generate ascending flow by ejecting the processing liquid into the processing tank
Implementation Method 2
a rectifying section configured to adjust flow of the processing liquid in a side space formed between a first side wall of the processing tank and a first substrate
Data Source
AI summary
A substrate processing apparatus includes: a processing tank that stores a processing liquid for performing a liquid processing on a plurality of substrates; a substrate support that supports the plurality of substrates such that main surfaces of each of the plurality of substrates follow a vertical direction in the processing tank; a processing liquid ejection unit provided below the plurality of substrates supported by the substrate support, and generates an ascending flow of the processing liquid in the processing tank; and a rectifying section that adjusts flow of the processing liquid in a side space formed between a first side wall of the processing tank and a first substrate having a main surface facing the first side wall of the processing tank among the plurality of substrates.