Substrate Temperature Control During Chemical Rinse
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Solution Overview
Problem
Substrate deformation occurs due to sudden and rapid temperature changes when high-temperature processing liquids are followed by low-temperature liquids during substrate processing, leading to instability in substrate holding and potential warping.
Innovation Solution
A method involving the sequential supply of a chemical liquid, a reaction liquid causing an exothermic reaction with the chemical liquid, and a rinse liquid, along with a heating fluid to the substrate, to manage temperature changes and reduce deformation. The reaction liquid mixes with the chemical liquid, and the heating fluid is applied to the opposite surface to stabilize the substrate's temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If low-temperature rinse liquid is supplied to a high-temperature substrate to rinse off processing liquid, then the substrate is cleaned effectively, but the substrate experiences sudden temperature decrease causing deformation and warping
Solution Approach 1:
The substrate temperature is adjusted in advance before rinse liquid supply by controlling the chemical liquid temperature and supply conditions, preventing sudden temperature changes when rinse liquid is applied
Solution Approach 2:
The temperature parameter of the chemical liquid is controlled to be close to the substrate temperature, and the rinse liquid temperature is gradually reduced through multiple stages, minimizing thermal shock and substrate deformation
2Productivity
If high-temperature chemical liquid is supplied to the substrate for processing, then the processing effectiveness is improved, but the substrate temperature becomes non-uniform causing localized stress and deformation
Solution Approach 1:
The chemical liquid supply is directed to specific regions of the substrate where processing is needed, rather than uniformly across the entire substrate, reducing overall thermal stress while maintaining processing effectiveness
Solution Approach 2:
The substrate temperature is pre-adjusted and monitored before chemical liquid supply to ensure it can withstand the thermal load without deforming, and the chemical liquid temperature is controlled to match the substrate temperature
3Loss of time
If the substrate temperature is rapidly changed to remove processing liquid, then the processing liquid is removed quickly, but the substrate deforms due to thermal contraction
Solution Approach 1:
The rinse process is divided into multiple periodic stages with gradually decreasing liquid temperatures, allowing the substrate to adapt to temperature changes incrementally rather than experiencing a single abrupt temperature drop
Solution Approach 2:
The temperature control and rinse processes are continued simultaneously to maintain substrate temperature uniformity throughout the entire rinse operation, preventing localized thermal contraction and deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces substrate deformation by gradually adjusting the temperature, maintaining substrate stability and preventing warping by minimizing temperature differences across the substrate surface.
Implementation Method 1
a reaction liquid, causing an exothermic reaction upon mixing with the chemical liquid
Implementation Method 2
supplying, in parallel to the reaction liquid supplying step, a heating fluid having lower temperature than the first temperature and higher temperature than the liquid temperature of the reaction liquid to another major surface of the substrate
Data Source
AI summary
A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off the liquid remaining on the substrate, a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate, and a temperature decrease suppressing step of supplying, in parallel to the hydrogen peroxide water supplying step, pure water having high temperature to a lower surface of the substrate.