Substrate Temperature Measurement with Dual Chamber Units
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Solution Overview
Problem
In substrate processing under vacuum conditions, accurate temperature measurement of substrates is hindered by foreign substance accumulation on non-contact temperature measurement devices, leading to inconsistent substrate temperature control, which affects the quality of semiconductor and thin film solar cell production.
Innovation Solution
A substrate processing apparatus with a dual temperature measurement system, where a first unit measures substrate temperatures inside the chamber and a second unit measures them outside, using correction values calculated from differences between the two measurements to ensure accurate temperature control by a heater unit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a non-contact temperature measurement device is used to measure substrate temperature inside the chamber, then the measurement can be performed without contact, but foreign substances accumulate on the device leading to inaccurate measurements
Solution Approach 1:
The patent extracts the temperature measurement function from inside the chamber to outside the chamber. The measurement device is positioned externally and measures the substrate temperature after the substrate exits the chamber, thereby preventing foreign substance accumulation on the measurement device while maintaining non-contact measurement capability
Solution Approach 2:
The system performs preliminary temperature measurement inside the chamber using a first measurement unit, then performs a second measurement outside the chamber. By comparing these measurements and calculating correction values in advance, the system compensates for temperature changes that occur during substrate transfer, maintaining measurement accuracy
2Measurement precision
If temperature measurement is performed inside the chamber, then the substrate temperature during processing can be measured, but foreign substance accumulation on the measurement device occurs
Solution Approach 1:
The patent relocates the primary temperature measurement device from inside the chamber to outside the chamber. The second measurement unit positioned externally measures the substrate temperature after it exits the chamber, eliminating exposure to process gases and preventing foreign substance accumulation while maintaining measurement capability
Solution Approach 2:
The patent introduces correction values as an intermediary mechanism. By measuring temperature inside the chamber with a first unit and outside with a second unit, then calculating the difference as a correction value, the system indirectly compensates for the inability to continuously measure inside the chamber without contamination
3Measurement precision
If correction values are calculated using measurements from both inside and outside the chamber, then temperature accuracy is improved, but the measurement system complexity increases
Solution Approach 1:
The system performs preliminary measurements inside the chamber and stores the data before the substrate exits. This preliminary action allows for comparison with external measurements and calculation of correction values without requiring complex real-time synchronized measurement systems
Solution Approach 2:
The patent implements a feedback mechanism where correction values calculated from the difference between internal and external measurements are applied to adjust the temperature control. This feedback loop continuously improves measurement accuracy without requiring a fundamentally complex system architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for uniform temperature control of the substrate by accurately measuring and correcting temperature discrepancies, enhancing the quality of semiconductor and thin film solar cell production.
Implementation Method 1
the temperature of the substrate is measured using a non-contact temperature measurement device, such as an optical thermometer
Implementation Method 2
the substrate is heated using a heating unit
Data Source
AI summary
Disclosed are a substrate processing apparatus, a temperature measurement method and a temperature control method. The substrate processing apparatus includes a chamber, a susceptor configured such that a substrate is placeable thereon, a heater unit configured to heat the susceptor, a temperature measurement unit configured to measure temperatures of the substrate, and a controller configured to control the heater unit using the temperatures of the substrate, and the temperature measurement unit includes a first measurement unit configured to measure temperatures of the substrate inside the chamber, a second measurement unit configured to measure temperatures of the substrate outside the chamber, a storage unit configured to store first data measured by the first measurement unit, second data measured by the second measurement unit, and third data calculated using the first data and the second data, and a determiner configured to calculate temperatures of the substrate using the third data.