Substrate Processing Liquid Supply Control via Temperature Feedback
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face issues with incomplete processing liquid distribution, leading to non-uniform processes, stains, and excessive liquid consumption due to inadequate control over the supply of etching and rinsing liquids during semiconductor and liquid crystal panel manufacturing.
Innovation Solution
A substrate processing apparatus equipped with a temperature detector and controller that monitors the substrate's surface temperature and adjusts the supply of processing liquids, ensuring they are distributed uniformly by stopping the supply when predetermined temperatures are reached, thereby optimizing process completion and liquid usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the processing liquid is supplied continuously to ensure complete coverage of the substrate surface, then the process uniformity is improved, but the processing liquid consumption increases excessively
Solution Approach 1:
The system uses a temperature detector to monitor the substrate surface temperature in real-time during the spinning process. The controller receives temperature feedback and adjusts the processing liquid supply accordingly - reducing or stopping supply when the predetermined temperature is reached, thereby preventing both over-supply (waste) and under-supply (poor uniformity).
Solution Approach 2:
The invention changes the supply parameter (processing liquid flow rate) based on the temperature parameter. By monitoring temperature changes during substrate rotation and adjusting liquid supply dynamically, the system optimizes both process uniformity and liquid consumption efficiency.
2Loss of substance
If the processing liquid supply is reduced to minimize consumption, then the processing liquid cost is reduced, but the process uniformity degrades and stains occur on the substrate surface
Solution Approach 1:
The temperature detector provides continuous feedback on substrate surface temperature, enabling the controller to determine the optimal moment to adjust liquid supply. This feedback mechanism ensures liquid is supplied sufficiently to maintain uniformity while stopping promptly to prevent waste, achieving both goals simultaneously.
Solution Approach 2:
The system transitions from static (fixed) liquid supply to dynamic (variable) supply based on real-time temperature conditions. The controller dynamically adjusts the liquid supply rate and timing according to the substrate's temperature state during rotation, optimizing both uniformity and consumption.
3Reliability
If the processing liquid is supplied at high rate to prevent stains and ensure complete coverage, then the process reliability is improved, but the processing liquid consumption increases significantly
Solution Approach 1:
By implementing temperature-based feedback control, the system maintains high process reliability through adequate liquid supply when needed (preventing stains and ensuring coverage) while automatically reducing supply when the substrate reaches the target temperature, thereby eliminating unnecessary consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances process uniformity, reduces the occurrence of stains, and minimizes processing liquid consumption by ensuring appropriate amounts are used, while also notifying users of potential failures, improving convenience and inspection efficiency.
Implementation Method 1
a temperature detector configured to detect a surface temperature of the substrate supplied with the processing liquid
Implementation Method 2
supplying the substrate surface with a processing liquid... the processing liquid remaining on the substrate surface degrades the process uniformity
Implementation Method 3
a centrifugal force of the rotation spreads the processing liquid over the substrate surface
Implementation Method 4
supplying approximately the center of a substrate surface with a processing liquid from a nozzle while the substrate is being rotated horizontally, so that a centrifugal force of the rotation spreads the processing liquid over the substrate surface
Data Source
AI summary
A substrate processing apparatus according to an embodiment includes: a liquid supplier configured to supply a processing liquid to a surface of a substrate; a temperature detector configured to detect a surface temperature of the substrate supplied with the processing liquid by the liquid supplier; a temperature monitor configured to determine whether or not the surface temperature detected by the temperature detector has reached a predetermined temperature; and a controller configured to cause the liquid supplier to stop supplying the processing liquid when the temperature monitor determines that the surface temperature has reached the predetermined temperature.