Multi-Zone Substrate Temperature Control Apparatus
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Solution Overview
Problem
Existing substrate temperature control apparatuses for semiconductor manufacturing require a large volume increase when dealing with multi-zone substrates due to the need for numerous heating units and controllers, which contradicts the trend of reducing apparatus size.
Innovation Solution
A substrate temperature control apparatus that includes a support plate with heating units, a power supply unit, a switch unit with MOSFET channels, and a controller that selectively turns on MOSFET channels based on temperature distribution information, along with filters to block high-frequency power signals, allowing for precise temperature control without increasing the apparatus volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a plurality of heating units and corresponding controllers are used to control temperature of each area of the substrate, then temperature control precision is improved, but apparatus volume increases
Solution Approach 1:
The patent combines multiple heating units into a single integrated heating structure with multiple heating zones, rather than using separate heating units for each zone. This merging approach maintains the ability to control temperature in different areas while reducing the overall apparatus volume by eliminating redundant components and consolidating the heating functionality into one unified system.
Solution Approach 2:
The single heating unit is designed to serve multiple functions by incorporating multiple heating zones that can be independently controlled. This multi-functional design allows one heating unit to replace what would traditionally require multiple separate heating units and their corresponding controllers, thereby reducing apparatus volume while maintaining temperature control precision across different substrate areas.
2Manufacturing precision
If numerous heating units and controllers are used for multi-zone substrates, then temperature distribution control is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple heating units into a single integrated heating unit with multiple heating zones, reducing device complexity by eliminating redundant components. The single heating unit structure simplifies the overall system architecture while maintaining the capability to control temperature distribution across different substrate areas through independent control of each heating zone.
Solution Approach 2:
The single heating unit is segmented into multiple heating zones that can be independently controlled. This segmentation allows for precise temperature distribution control across different substrate areas while keeping the overall structure unified and simpler than having completely separate heating units for each zone.
3Adaptability or versatility
If multiple power supply units are used for multiple heating units, then temperature control capability is improved, but apparatus volume increases
Solution Approach 1:
The patent merges multiple power supply units into a single power supply unit that can provide power to multiple heating zones within the integrated heating unit. This consolidation maintains the adaptability and versatility of controlling temperature in different areas while significantly reducing apparatus volume by eliminating the need for multiple separate power supply units.
Solution Approach 2:
The single power supply unit is designed with multi-functionality to control multiple heating zones within the integrated heating unit. It can selectively supply power to different heating zones based on temperature requirements, providing the same temperature control capability as multiple separate power supply units would offer, but with reduced apparatus volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient temperature control of multi-zone substrates with reduced apparatus volume by selectively powering heating units based on temperature distribution, while minimizing the need for multiple power supply units, controllers, and filters, thus optimizing space and operational efficiency.
Implementation Method 1
a plurality of heating units placed in different area of the substrate and controlling a temperature of the substrate by each area
Implementation Method 2
a switch unit connected between the plurality of heating units and the power supply unit, and including one or more transistor devices
Implementation Method 3
a first filter connected between the power supply unit and the switch unit, and blocking high-frequency power signal which flows into the power supply unit
Data Source
AI summary
An embodiment includes an apparatus for controlling temperature of a substrate, an apparatus for treating a substrate comprising the same, and a method of controlling the same, which may control the temperature of the substrate by each area and not increasing the volume of the apparatus. The substrate temperature control apparatus comprises: a support plate for supporting a substrate; a plurality of heating units placed in different area of the substrate and controlling a temperature of the substrate by each area; a power supply unit for providing a power to control the temperature of the substrate; a switch unit connected between the plurality of heating units and the power supply unit, and obtaining one or more of a transistor device; and a controller for controlling a power which is supplied to each heating units by controlling unit.