Substrate Temperature Feedback Control for AC Bias Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
AC bias during aluminum film deposition increases substrate temperature, leading to film surface roughness and contamination of electrostatic chucks, which degrades film morphology and reduces heat transfer efficiency.
Innovation Solution
A system and method for controlling substrate temperature by measuring defects post-deposition, analyzing substrate properties, and sending feedback signals to adjust temperature control parameters to mitigate surface degradation and contamination effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If AC bias is used during aluminum film deposition, then aluminum coverage on the substrate is improved, but substrate temperature increases causing film surface roughness
Solution Approach 1:
The patent implements a feedback control system that measures substrate temperature during deposition and adjusts the AC bias power accordingly. When temperature exceeds a threshold, the system automatically reduces AC bias power to prevent excessive heating while maintaining adequate aluminum coverage.
Solution Approach 2:
The system dynamically changes the AC bias power parameter based on real-time temperature measurements. By adjusting this parameter, the system optimizes the balance between achieving sufficient aluminum coverage and preventing substrate temperature from rising too high.
2Manufacturing precision
If AC bias is used during aluminum film deposition, then aluminum coverage on the substrate is improved, but film surface roughness increases
Solution Approach 1:
The feedback control system monitors substrate temperature and adjusts AC bias power to prevent excessive heating that would cause surface roughness. By maintaining temperature within optimal ranges, the system achieves good aluminum coverage while preserving film surface quality.
3Temperature
If electrostatic chuck is used for substrate heating, then substrate temperature control is improved, but outer edges become contaminated reducing heat transfer efficiency
Solution Approach 1:
The system monitors temperature distribution across the substrate and detects deviations that indicate contamination. When heat transfer efficiency decreases, the feedback control adjusts heating parameters to compensate for the reduced efficiency caused by contamination on the electrostatic chuck edges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces substrate defects and improves yield by compensating for AC bias-induced surface degradation and electrostatic chuck contamination through dynamic temperature control.
Implementation Method 1
a measurement device coupled to the measurement chamber configured to measure at least a portion of the substrate when disposed in the measurement chamber
Implementation Method 2
a temperature controller used in controlling a temperature of the substrate in the deposition process
Data Source
AI summary
Methods and apparatus for controlling substrate temperature includes: measuring a substrate that has undergone a deposition process; analyzing measurements of the substrate to detect a defect of the substrate; and sending a feedback signal to modify a temperature control parameter of a temperature controller used in controlling a temperature of the substrate in the deposition process based on the analyzing if a defect is detected, and not sending a feedback signal to modify the temperature control parameter if a defect is not detected.