Substrate Temperature Correction via Heat Transfer Gas Pressure
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Solution Overview
Problem
Existing substrate processing technologies face challenges in maintaining consistent substrate temperatures due to changes in the temperature control medium, leading to unintended temperature changes in the substrate during processing.
Innovation Solution
A substrate processing apparatus equipped with a placing table, gas supply, measurement unit, and controller, which adjusts the pressure of a heat transfer gas to compensate for temperature changes in the temperature control medium, thereby stabilizing the substrate temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the temperature of the temperature control medium is changed to adjust substrate temperature, then the substrate temperature can be adjusted, but the substrate temperature becomes unstable due to temperature fluctuations in the temperature control medium
Solution Approach 1:
The system employs a feedback mechanism where the temperature of the temperature control medium is continuously monitored, and based on this measurement, the pressure of the heat transfer gas is automatically adjusted to compensate for temperature fluctuations. This closed-loop control ensures that substrate temperature remains stable despite variations in the temperature control medium.
Solution Approach 2:
The system changes the pressure parameter of the heat transfer gas to compensate for temperature changes in the temperature control medium. By adjusting the pressure of the heat transfer gas supplied to the discharge opening, the system can counteract the effects of temperature fluctuations and maintain stable substrate temperature.
2Reliability
If the pressure of the heat transfer gas is increased to compensate for temperature changes, then substrate temperature stability is improved, but the complexity of the control system increases
Solution Approach 1:
The controller receives temperature information from the measurement unit and automatically adjusts the heat transfer gas pressure accordingly. This automated feedback loop eliminates the need for complex manual control mechanisms while maintaining substrate temperature stability.
Solution Approach 2:
The system uses the temperature measurement information to self-regulate the heat transfer gas pressure without requiring external intervention. The controller automatically makes the necessary pressure adjustments based on the measured temperature of the temperature control medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses temperature changes in the substrate caused by fluctuations in the temperature control medium, ensuring more precise and consistent substrate processing.
Implementation Method 1
a discharge opening (11b) through which a heat transfer gas is discharged to the placing surface (11a)
Data Source
AI summary
A placing table includes a placing surface, a flow path formed inside to allow a temperature control medium to flow therein, and a discharge opening through which a heat transfer gas is discharged. A gas supply is configured to supply the heat transfer gas to be discharged through the discharge opening. A measurement unit is configured to measure a temperature of the temperature control medium. A controller is configured to control, when the temperature of the temperature control medium is changed by equal to or more than a predetermined temperature at a change timing, a pressure of the heat transfer gas to eliminate a temperature change of a substrate caused by a temperature change of the temperature control medium after a predetermined time taken before the temperature change of the substrate takes place due to the temperature change of the temperature control medium passes by from the change timing.