Substrate Temperature Compensation for Semiconductor Overlay Alignment
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Solution Overview
Problem
As semiconductor devices become increasingly complex, misalignment of layers during manufacturing can lead to malfunctions such as connection failures and short circuits, highlighting the need for effective overlay control in semiconductor processes.
Innovation Solution
A method and system utilizing temperature control to compensate manufacturing errors by generating a temperature controlling signal based on the difference between the location of an alignment symbol and a reference alignment symbol, allowing for precise adjustment of substrate temperatures to ensure accurate layer alignment through a lamination process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional lithography alignment methods are used, then the manufacturing process can proceed with standard equipment, but layer misalignment occurs leading to connection failures and short circuits
Solution Approach 1:
The patent changes the physical state of the substrate by controlling temperature to induce thermal expansion or contraction, thereby adjusting the position of alignment symbols and achieving precise overlay alignment between layers without mechanical repositioning
Solution Approach 2:
The patent replaces traditional mechanical alignment methods with thermal field control, using temperature-dependent dimensional changes to achieve positioning accuracy that prevents connection failures and short circuits
2Manufacturing precision
If temperature control is applied to adjust alignment symbol positions, then overlay precision is improved, but process complexity increases
Solution Approach 1:
The patent introduces temperature as an intermediary parameter to mediate between the substrate structure and alignment requirements, using thermal expansion/contraction of the substrate to adjust alignment symbol positions without direct mechanical intervention
Solution Approach 2:
The patent utilizes temperature as a controllable parameter to induce dimensional changes in the substrate, transforming a positioning problem into a thermal management problem that can be solved through temperature profiling and control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces manufacturing errors by ensuring accurate overlay control, preventing malfunctions and improving the reliability of semiconductor devices by adjusting substrate temperatures to align layers correctly.
Implementation Method 1
generating a temperature controlling signal based on the difference signal, the temperature controlling signal controlling operation of the temperature controller in order to control one of a temperature of an affecting part of the substrate, a temperature of an affecting part of the another substrate
Data Source
AI summary
A method for compensating a manufacturing error in a semiconductor process is implemented using a system that includes at least one temperature controller. The method includes: generating a reading signal associated with a location of an alignment symbol on a substrate; generating a difference signal based on the reading signal, the difference signal indicating a difference between the location of the alignment symbol and a location of a reference alignment symbol, the reference alignment symbol being on another substrate; and generating a temperature controlling signal based on the difference signal, the temperature controlling signal controlling operation of the temperature controller to control one of a temperature of an affecting part of the substrate, a temperature of an affecting part of the another substrate, and a combination thereof. Then, a lamination process is implemented to bond the substrate and the another substrate together.