Substrate Chamber Temperature Sensing for Uniform Film Formation

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in accurately measuring temperatures near substrates, leading to difficulties in achieving uniform processing.

Innovation Solution

The apparatus includes a reaction chamber with a heater and an exhauster, featuring a first temperature measurer that extends into the chamber to measure temperature distributions across the substrate surface, allowing for precise temperature control using data from multiple temperature sensors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a thermocouple is used to measure temperature in the process chamber, then temperature measurement is enabled, but the temperature in the vicinity of substrates cannot be accurately measured

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidtemperature distribution information
Core Design Contradiction:
Measurement precisionVSLoss of information

Solution Approach 1:

The temperature measurement function is segmented into multiple independent temperature measurers (first temperature measurer and second temperature measurer) positioned at different locations within the process chamber. The first temperature measurer measures temperature near the substrate, while the second temperature measurer measures temperature at another position, enabling comprehensive temperature distribution measurement through multiple discrete measurement points

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The temperature measurement is extended from a single-point measurement (one-dimensional) to multi-point spatial measurement (three-dimensional). By positioning temperature measurers at different spatial coordinates within the process chamber, the system captures temperature distribution across multiple dimensions, transforming the measurement from a scalar value to a spatial field

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If feedback control is performed based on temperature measurement from a single thermocouple, then temperature control is achieved, but processing uniformity of substrates cannot be improved

Engineering Contradiction:
Improvetemperature controlVSAvoidprocessing uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The temperature control system transitions from global temperature control (single thermocouple representing the entire chamber) to local temperature control (multiple temperature measurers capturing local temperature variations). Each temperature measurer provides information about its local region, enabling differentiated control strategies for different zones within the process chamber to achieve uniform substrate processing

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system implements feedback control using temperature measurements from multiple temperature measurers. The controller receives temperature information from both the first temperature measurer (near substrate) and the second temperature measurer (at another position), and adjusts heating conditions based on this multi-point feedback to maintain uniform temperature distribution across all substrates

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables homogeneous processing of multiple substrates by accurately controlling temperature distributions, ensuring uniform film formation and improving processing uniformity.

Implementation Method 1

a heater that is installed outside the process chamber and heats the process chamber

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a thermocouple that measures a temperature of the process chamber

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

an exhauster disposed laterally to the reaction chamber

Methodology Applied
Scientific EffectVacuum pumping: Vacuum

Data Source

PatentUS20240254630A1Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium
Publication Date: 2024.08.01 KOKUSAI DENKI KK
  • US20240254630A1 patent drawing
  • US20240254630A1 patent drawing
  • US20240254630A1 patent drawing

AI summary

A technique including a reaction chamber that accommodates a substrate held by a substrate holder, a heater disposed around the reaction chamber, and an exhauster disposed laterally to the reaction chamber and configured to be capable of accommodating a first temperature measurer disposed extending in a direction parallel to a surface of the substrate held by the substrate holder from the outside of the reaction chamber toward the inside of the reaction chamber.