Substrate Temperature Control Model for Uniform Wafer Heating

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in achieving uniform temperature adjustment across substrates due to locally uneven temperatures caused by machine differences, leading to reduced adjustment accuracy.

Innovation Solution

An analysis apparatus that includes a trainer to generate a trained model using setting parameters for temperature adjustment elements in a substrate support, and a calculator to determine optimal setting parameters for heaters based on a target temperature, improving temperature uniformity through pre-training and additional training phases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If setting temperatures for temperature adjustment elements are set to the target temperature, then the temperature control is simplified, but the in-plane average temperature of the substrate deviates from the target temperature due to locally uneven temperatures

Engineering Contradiction:

Improvetemperature control simplicityVSAvoidtemperature adjustment accuracy

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by modifying the setting temperatures of temperature adjustment elements based on measured temperature deviations. Instead of using a fixed target temperature for all elements, the system calculates corrected setting temperatures that account for local uneven temperatures, thereby improving the in-plane average temperature accuracy while maintaining operational simplicity through automated calculation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent implements feedback by measuring the actual temperatures at multiple positions on the substrate, comparing them to the target temperature, and using this information to adjust the setting temperatures of the temperature adjustment elements. This closed-loop control ensures that the in-plane average temperature converges to the target temperature, resolving the accuracy issue while keeping the control process systematic and manageable.

Inventive Principle:

Principle #23Feedback

2Adaptability or versatility

If temperature adjustment elements are used in different regions, then regional temperature control is enabled, but locally uneven temperatures cause the overall substrate temperature to deviate from the target

Engineering Contradiction:

Improveregional temperature control capabilityVSAvoidin-plane average temperature accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by dividing the substrate support into multiple regions with independent temperature adjustment elements, allowing each region to be controlled according to its specific thermal characteristics. The system then integrates these local controls through calculated setting temperatures that ensure the overall in-plane average temperature meets the target, thus maintaining both regional adaptability and global accuracy.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent modifies the setting parameters of temperature adjustment elements based on measured temperature distributions. By calculating corrected setting temperatures that account for local variations and their impact on the in-plane average, the system achieves both regional control flexibility and overall temperature accuracy simultaneously.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If machine differences are present, then device individuality is acknowledged, but temperature uniformity across the substrate is compromised

Engineering Contradiction:

Improvedevice individuality accommodationVSAvoidtemperature uniformity

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent enables the substrate processing apparatus to self-adjust by automatically measuring temperature distributions and calculating corrected setting temperatures for its own temperature adjustment elements. This self-service mechanism compensates for machine-specific differences without requiring external calibration or manual intervention, thereby maintaining temperature uniformity while accommodating device individuality.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent uses feedback from temperature measurements to automatically compensate for machine differences. By continuously monitoring the actual temperature distribution and adjusting the setting temperatures of adjustment elements accordingly, the system maintains temperature uniformity despite individual device variations, eliminating the need for manual calibration.

Inventive Principle:

Principle #23Feedback

Data Source

PatentUS20250013213A1Analysis apparatus, substrate processing system, substrate processing apparatus, analysis method, and analysis program

Publication Date: 2025.01.09 TOKYO ELECTRON LTD

AI summary

An analysis apparatus, a substrate processing system, a substrate processing apparatus, an analysis method, and an analysis program improve adjustment accuracy in adjusting the temperature of a substrate. The analysis apparatus includes circuitry that performs training to generate a trained model using setting parameters for temperature adjustment elements in regions divided from a substrate support in a process space in a first vacuum environment and using a first temperature data set that is data of temperatures at positions on a substrate supported by the substrate support, and that calculates setting parameters for the temperature adjustment elements corresponding to a target temperature of the substrate using the trained model.