Substrate Terminal Abutting Portion Design
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Solution Overview
Problem
Conventional substrate terminals face issues with high load on solder portions during attachment and detachment, leading to potential deterioration of the electric connection state due to insufficient support from resin housings or the need for additional parts to distribute forces.
Innovation Solution
A substrate terminal design featuring a substrate abutting portion formed by bending processing, which projects orthogonally to the insertion direction, connects the substrate connection and terminal connection portions, and disperses the pressing force onto the substrate and solder portions, reducing stress concentration on the solder portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate terminal uses a resin housing to support pressing force and tensile force, then the terminal connection is stabilized, but the resin housing may not be strong enough and the solder portion still receives excessive load
Solution Approach 1:
The substrate terminal body is divided into functionally distinct portions: the substrate connection portion for soldering, the terminal connection portion for mating connections, and the intermediate portion that serves as a force-distributing structure. This segmentation allows each portion to be optimized for its specific function, with the intermediate portion specifically designed to receive and distribute mechanical loads away from the solder joint.
Solution Approach 2:
The intermediate portion acts as an intermediary structure between the substrate connection portion and the terminal connection portion. It receives pressing force from inserted terminals and tensile force during detachment, mediating these forces through its structural design (including the substrate abutting portion) to prevent direct transmission to the solder joint, thereby protecting the electrical connection.
2Strength
If additional plates are added to receive pressing force and tensile force, then the load on solder portion is reduced, but the number of parts increases and cost increases
Solution Approach 1:
The substrate terminal integrates multiple functions into a single component structure. The substrate terminal body combines the substrate connection portion, terminal connection portion, and intermediate portion with force-receiving capabilities into one piece, eliminating the need for separate plates or housings. The intermediate portion itself is designed with substrate abutting portions that directly receive and distribute mechanical loads, merging the force-receiving function into the terminal structure.
Solution Approach 2:
The substrate terminal body serves multiple functions simultaneously: it provides electrical connection through the substrate connection portion, accepts mating terminals through the terminal connection portion, and distributes mechanical loads through the intermediate portion with substrate abutting portions. This multi-functionality eliminates the need for separate dedicated force-receiving components.
3Strength
If the substrate terminal is molded into a crank form with intermediate portion held between two resin plates, then the load on solder portion is reduced, but the size and weight increase
Solution Approach 1:
The substrate terminal integrates the intermediate portion and force-receiving functionality into a single molded body without requiring separate plates or housings. The intermediate portion includes substrate abutting portions that directly engage with the substrate to receive and distribute mechanical loads, eliminating the need for additional weight-bearing components.
Solution Approach 2:
The design extracts the essential force-receiving function from separate plates or housings and incorporates it directly into the substrate terminal body through the intermediate portion with substrate abutting portions. This extraction eliminates unnecessary components and their associated weight while maintaining the load-reduction benefit.
Data Source
AI summary
A substrate terminal includes at least one substrate connection portion that is inserted into a hole portion in a substrate from one surface side of the substrate and is soldered together with the hole portion, a terminal connection portion into which an opposite-side terminal is inserted in a direction same as an insertion direction of the substrate connection portion into the hole portion and that is connected to the opposite-side terminal, an intermediate portion that connects the substrate connection portion and the terminal connection portion, and at least one substrate abutting portion that is made to project in a direction orthogonal to the insertion direction and is made to abut against the one surface of the substrate with the substrate connection portion and the hole portion soldered. The substrate abutting portion is formed on a base member by bending processing.