Substrate Test Wiring Layout for Cutting and Grinding Verification
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Solution Overview
Problem
Conventional methods for manufacturing electronic devices, such as tiling display panels, require manual inspection using optical microscopes to verify cutting and grinding results, leading to time-consuming and error-prone processes.
Innovation Solution
The implementation of an electronic device manufacturing method that includes the formation of test wirings on the substrate, allowing for conducting tests to determine if cutting and grinding processes meet specifications, thereby eliminating the need for manual inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual inspection using optical microscope is used to verify cutting and grinding results, then measurement precision can be achieved, but testing time increases and human errors occur
Solution Approach 1:
The patent replaces the manual optical microscope inspection system with an automated electrical testing system. Test wirings are embedded in the substrate during manufacturing, and electrical connection tests are performed automatically to verify cutting and grinding results, eliminating the need for manual optical inspection and significantly reducing testing time while maintaining accuracy
Solution Approach 2:
The substrate itself provides the testing capability through embedded test wirings that are part of the substrate structure. The substrate performs self-verification through electrical connection tests, eliminating the need for external manual inspection tools and reducing dependency on human operators
2Measurement precision
If manual inspection using optical microscope is used to verify cutting and grinding results, then measurement precision can be achieved, but human errors increase
Solution Approach 1:
The patent replaces the manual optical microscope inspection system with an automated electrical testing system. Test wirings are embedded in the substrate during manufacturing, and electrical connection tests are performed automatically to verify cutting and grinding results, eliminating the need for manual optical inspection and significantly reducing testing time while maintaining accuracy
Solution Approach 2:
The electrical testing system provides immediate feedback on the quality of cutting and grinding operations. The automated testing system objectively records test results, eliminating human error in judgment and providing reliable, consistent verification of manufacturing quality
3Productivity
If test wirings are embedded in the substrate, then testing efficiency is improved, but device complexity increases
Solution Approach 1:
The test wirings serve multiple functions: they are part of the substrate's electrical interconnection structure and simultaneously serve as test leads for quality verification. This multi-functionality reduces the need for separate dedicated test structures, minimizing the increase in overall device complexity while maintaining high testing efficiency
Data Source
AI summary
An electronic device includes a substrate and a wiring structure disposed on the substrate. The substrate includes a first surface, a second surface, a first side surface, and a second side surface. The wiring structure includes a first wiring, a second wiring, a third wiring, a first pad, and a second pad, the first pad is electrically connected to the first wiring through the second wiring, and the second pad is electrically connected to the first wiring through the third wiring. The second wiring includes a first line segment disposed on the first surface, a second line segment disposed on the first side surface, and a third line segment disposed on the second surface. The third wiring includes a fourth line segment disposed on the first surface, a fifth line segment disposed on the second side surface, and a sixth line segment disposed on the second surface.