Substrate Testing with 3D Scanner and Electrical Probes
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Solution Overview
Problem
Current substrate testing methods require separate devices for electrical, optical, and geometrical testing, leading to increased testing times, risk of substrate damage during handling, and difficulty in error diagnostics due to the separation of these tests.
Innovation Solution
A substrate testing device equipped with a three-dimensional scanner that performs electrical, optical, and geometrical tests concurrently or sequentially, using a combination of electrical probes, optical fiber alignment, and three-dimensional scanning to align and test the substrate, thereby reducing testing time and risk of damage while improving diagnostics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If separate substrate testing devices are used for electrical/optical testing and geometrical testing, then each device can be specialized and simple, but the overall testing time increases and the risk of substrate damage during transfer increases
Solution Approach 1:
The patent combines electrical testing components, optical testing components, and geometrical testing components into a single integrated substrate testing device. This merging eliminates the need to transfer substrates between separate devices, thereby reducing overall testing time while maintaining the specialized functionality of each testing component through modular integration.
Solution Approach 2:
The substrate testing device is designed with multi-functionality, capable of performing electrical tests, optical tests, and geometrical tests on the same substrate within a single device platform. This universal design allows one device to replace multiple specialized devices, reducing transfer operations and associated risks.
2Device complexity
If separate substrate testing devices are used for electrical/optical testing and geometrical testing, then each device can be optimized for its specific function, but the risk of substrate damage during handling increases
Solution Approach 1:
By merging electrical, optical, and geometrical testing capabilities into one device, the patent eliminates multiple substrate transfer operations. This reduces the opportunities for handling errors and physical damage, thereby improving substrate integrity and test reliability.
3Device complexity
If separate substrate testing devices are used for electrical/optical testing and geometrical testing, then each device can be specialized, but error diagnostics become more difficult
Solution Approach 1:
The integrated device merges multiple testing functions and combines their diagnostic capabilities into a unified system. This allows for cross-correlation of test results from different measurement types and provides comprehensive error diagnostics within a single platform, making it easier to identify and troubleshoot issues.
4Loss of time
If an integrated substrate testing device is used to perform electrical, optical, and geometrical tests concurrently or sequentially, then testing time is reduced and substrate damage risk is minimized, but the device complexity increases
Solution Approach 1:
The integrated substrate testing device employs segmentation by dividing the system into distinct modular components for electrical testing, optical testing, and geometrical testing. Each module can be independently designed, maintained, and calibrated, which manages overall device complexity while enabling concurrent or sequential operation to reduce total testing time.
5Reliability
If an integrated substrate testing device is used to perform electrical, optical, and geometrical tests concurrently or sequentially, then substrate damage risk is minimized, but the device complexity increases
Solution Approach 1:
By segmenting the integrated device into specialized modules, the patent achieves reliable substrate testing with minimized handling while managing complexity through modular design. Each segment performs its specific function within the unified platform.
Solution Approach 2:
The universal substrate testing device performs electrical, optical, and geometrical tests in one platform, eliminating substrate transfers and improving reliability. The multi-functional design is managed through modular architecture that integrates diverse testing capabilities.
Data Source
AI summary
A substrate testing device includes a first testing component configured to couple to electrical pads of a substrate and perform electrical testing on one or more dies of the substrate during a test. The substrate testing device includes a second testing component configured to perform optical testing of the one or more dies during the test. The substrate testing device further includes a third testing component comprising a three-dimensional scanner configured to perform a dimensional scan of the one or more dies of the substrate, wherein the third testing component is to perform geometrical testing on the one or more dies during the test.