Electronic Device With Substrate Testing Circuits for Connection Reliability
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Solution Overview
Problem
Existing electronic devices face challenges in verifying the electrical connections between circuits, which affects their reliability and performance.
Innovation Solution
A method is introduced for manufacturing electronic devices that involves forming circuits on both surfaces of a substrate, applying testing signals to verify electrical connections, and using multiple inspection processes to ensure proper circuit integration, including optical and electrical inspections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple inspection processes are implemented to verify electrical connections, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by performing electrical connection verification during the manufacturing process itself, rather than after completion. Testing circuits are formed and used to verify connections between first and second circuits on the substrate before final device assembly, allowing defects to be detected and corrected early in the manufacturing sequence
Solution Approach 2:
The patent uses an intermediary testing circuit as a mediator to verify electrical connections. The testing circuit includes test signal input terminals, test signal output terminals, and conductive paths that serve as intermediate elements to facilitate the verification process between the first and second circuits without requiring direct complex testing arrangements
2Manufacturing precision
If comprehensive testing signals are applied to verify electrical connections, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The patent merges the verification function into the existing circuit structure by forming testing circuits that share the substrate and manufacturing processes with the main device circuits. The testing circuits are integrated alongside the first and second circuits, allowing simultaneous verification of multiple electrical connections through a unified testing approach rather than separate sequential tests
Data Source
AI summary
An electronic device includes a substrate, an electronic element, a layer, a plurality of first bonding pads, a transistor and a plurality of second bonding pads. The electronic element is disposed on the substrate. The layer is disposed between the substrate and the electronic element. The plurality of first bonding pads are disposed corresponding to the electronic element. The transistor is electrically connected with the electronic element through the plurality of first bonding pads. The substrate is disposed between the plurality of first bonding pads and the plurality of second bonding pads. The transistor is disposed between the plurality of first bonding pads and the substrate.