Substrate Surface Texturing via Patterned Masking and Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for texturing substrate surfaces, such as glass, typically produce isotropic surfaces and struggle to pattern multiple types of features onto a substrate surface using a single step process.
Innovation Solution
A method for creating a substrate surface with multiple co-located textures, including a periodic first texture and an isotropic second texture, using a masking material and an etchant applied in a predetermined pattern to the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional texturing methods (wet etching, dry etching, laser ablation) are used, then substrate surface can be textured, but only isotropic surfaces are produced and multiple types of features cannot be patterned in a single step
Solution Approach 1:
The patent segments the texturing process by applying masking material with specific ridge patterns that define different etching zones. The masking material is applied in a predetermined pattern with ridges spaced at specific intervals, creating segmented regions that will develop different texture types (periodic first texture, periodic second texture, isotropic second texture) during the etching process.
Solution Approach 2:
The patent implements local quality by creating different surface texture characteristics in different regions of the substrate. The masking material ridges create localized areas with specific etching rates and patterns, resulting in co-located textures with different magnitudes, spatial periods, and anisotropy levels across the substrate surface.
2Adaptability or versatility
If multiple texturing processes are used to create different surface features, then multiple functionalities can be achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges multiple texturing operations into a single etching step by using a strategically patterned masking material. The masking material with its ridge pattern allows different regions of the substrate to receive controlled etching, simultaneously creating multiple texture types (first periodic texture, second periodic texture, and isotropic texture) in one process cycle, eliminating the need for separate texturing steps.
Solution Approach 2:
The masking material serves multiple functions: it defines pattern regions, controls etching rates, creates periodic textures through ridge spacing, and enables co-located isotropic textures. This single material system performs what would traditionally require multiple specialized processes, reducing manufacturing complexity while achieving multiple surface functionalities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves an anisotropic surface texture with specific magnitudes and spatial periods, enabling multiple functionalities for the same product without the need for costly capital engineering upgrades.
Implementation Method 1
applying an etchant on a first major surface of the substrate in a predetermined pattern as the substrate is conveyed. The etchant etches the first major surface and forms a first texture with a first magnitude and a first spatial period along a first axis.
Implementation Method 2
applying a masking material to a first major surface of the substrate in a first predetermined pattern as the substrate is conveyed
Data Source
AI summary
Apparatus and method for treating a substrate, for example texturing a substrate. In some embodiments, a masking material is applied to a surface of the substrate in a predetermined pattern, the surface thereafter contacted with an etchant that removes the masking material. Contacting the surface with the etchant produces multiple co-located textures. In other embodiments, the masking step can be eliminated, and the etchant is applied in a predetermined pattern to produce multiple co-located textures. In still other embodiments, the substrate has a chemical composition, and the substrate is exposed to a leachant that leaches at least one constituent of the chemical composition to produce a substrate with a varying chemical composition at the substrate surface.