Substrate Thawing Nozzle Layout for Wafer Particle Discharge
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Solution Overview
Problem
Existing substrate cleaning techniques face inefficiencies in removing incrustations such as particles from substrate surfaces, particularly in semiconductor wafers, due to uniform application of freezing and thawing solutions which hinder effective discharge of adhered particles.
Innovation Solution
A substrate processing apparatus and method that utilizes a nozzle with differential supply volume, temperature, or timing of thawing solution to the substrate, creating a gradient in the thawing process to efficiently remove incrustations by thawing the freezing film from the outer periphery first, allowing efficient discharge of particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If uniform thawing solution is supplied to the entire substrate surface, then the freezing film is thawed evenly, but particles adhering to the substrate surface cannot be effectively discharged
Solution Approach 1:
The patent applies local quality by dividing the substrate surface into multiple regions (central region and peripheral regions) and supplying thawing solution with different characteristics to each region. Specifically, the peripheral regions receive thawing solution with higher supply volume, higher temperature, or earlier timing compared to the central region, enabling differentiated thawing that facilitates particle discharge from peripheral areas while maintaining central region cleaning quality.
Solution Approach 2:
The patent segments the substrate surface into multiple processing zones and implements independent control of thawing solution parameters for each zone. The nozzle is divided into multiple solution supply ports positioned at different locations, allowing separate control of thawing solution characteristics for central and peripheral regions, thereby resolving the contradiction between uniform thawing and effective particle discharge.
2Productivity
If thawing solution supply volume is increased to improve particle discharge, then peripheral particles are removed more effectively, but excessive solution usage and potential damage to substrate increase
Solution Approach 1:
The patent implements local quality by adjusting the supply volume of thawing solution according to the specific needs of different substrate regions. The peripheral regions, which benefit more from increased solution volume for particle discharge, receive higher supply volume, while the central region receives reduced supply volume. This spatially differentiated approach maximizes particle removal efficiency while minimizing overall thawing solution consumption.
Solution Approach 2:
The patent applies partial action by providing excessive thawing solution volume only to the peripheral regions where it is most needed for particle discharge, rather than uniformly increasing supply across the entire substrate. This selective application of excessive action to specific zones achieves effective particle removal while controlling overall solution usage.
3Productivity
If higher temperature thawing solution is supplied to enhance particle removal, then cleaning efficiency improves, but risk of substrate damage and thermal stress increases
Solution Approach 1:
The patent applies local quality by supplying thawing solution at different temperatures to different substrate regions. The peripheral regions receive higher temperature thawing solution to enhance particle discharge efficiency, while the central region receives lower temperature solution to minimize thermal stress and damage risk. This spatially differentiated temperature control optimizes cleaning efficiency while managing substrate damage risks.
Solution Approach 2:
The patent implements partial action by applying the potentially harmful effect of high-temperature thawing solution only to the peripheral regions where it provides maximum benefit for particle removal, rather than applying high temperature uniformly across the entire substrate. This selective application minimizes overall thermal stress on the substrate while maintaining high cleaning efficiency at critical peripheral zones.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the cleaning efficiency by ensuring incrustations are effectively removed from both the central and peripheral areas of the substrate, improving the overall cleaning process.
Implementation Method 1
cooling the freezing solution to a temperature below a freezing point of the freezing solution to form a freezing film
Implementation Method 2
thawing the freezing film by supplying the thawing solution
Data Source
AI summary
A substrate processing apparatus according to one embodiment includes a substrate holding part having a stage holding the substrate, a freezing solution supply part supplying the freezing solution to the substrate, a cooling part cooling the freezing solution to form a freezing film, and a thawing solution supply part having a nozzle extending in a first direction including a central part of the stage in a plan view, wherein an end and an other end opposite to the end of the nozzle in the first direction are located on an outer periphery outside of the central part, and the thawing solution supply part supplies a thawing solution having at least one of a different supply volume, temperature, or supply timing between the central part and the outer periphery to the substrate to thaw the freezing film.