Multi-Layer Substrate Thermal Conduction for Accurate Temperature Detection
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Solution Overview
Problem
In multi-layer electronic devices, the heat generated by a heat-generating element is not sufficiently conducted to a temperature detecting element, leading to inaccurate temperature detection, as the peripheral heat generation pattern is reduced to prioritize proximity between the elements.
Innovation Solution
The implementation of a substrate with a heat generation part pattern connected to the heat-generating element, a direct under layer pattern on the opposite surface, and interlayer connection pillars to efficiently conduct heat from the heat generation part pattern to the direct under layer pattern and then to the temperature detecting element, ensuring accurate temperature detection even when the elements are separated by multiple layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the temperature detecting element and heat generating element are arranged adjacent to each other, then temperature detection accuracy is improved, but heat dispersibility deteriorates due to reduced peripheral heat generation part pattern area
Solution Approach 1:
The patent transitions from a single-layer planar arrangement to a multi-layer three-dimensional configuration. The heat generating element is placed on one layer while the temperature detecting element is positioned on an adjacent layer, enabling spatial separation in the vertical dimension. This dimensional transition allows both elements to maintain optimal thermal characteristics while achieving accurate temperature detection through controlled thermal coupling via conductive patterns spanning multiple layers.
2Temperature
If the temperature detecting element and heat generating element are separated in multi-layer boards, then heat dispersibility is maintained, but temperature detection accuracy deteriorates due to insufficient heat conduction through multiple layers
Solution Approach 1:
The patent introduces conductive patterns as intermediary thermal pathways between the heat generating element and temperature detecting element in multi-layer configurations. These conductive patterns act as thermal mediators that efficiently transfer heat through the substrate layers, enabling accurate temperature detection even when elements are spatially separated across multiple layers. The intermediary conductive structures overcome the thermal resistance of the substrate material.
3Measurement precision
If the peripheral heat generation part pattern is reduced to prioritize proximity between elements, then temperature detection accuracy is improved, but heat dispersibility deteriorates
Solution Approach 1:
The patent resolves the conflict between detection accuracy and heat dispersibility by utilizing vertical layering. The heat generating element maintains its full peripheral pattern area for optimal heat generation and dispersal, while the temperature detecting element is positioned on an adjacent layer. This spatial separation in the vertical dimension eliminates the need to reduce the heat generation pattern area, as both elements can coexist without thermal interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for accurate temperature detection of the heat-generating element, maintaining heat dispersibility and flexibility in design, effectively addressing the limitations of existing technologies in multi-layer boards.
Implementation Method 1
The interlayer connection pillar connects between the heat generation part pattern and the direct under layer pattern to conduct heat from the heat generation part pattern to at least the direct under layer pattern
Implementation Method 2
the heat generated from the heat generating element is conducted to the direct under layer pattern through the heat generation part pattern and the interlayer connection pillar, and is further conducted from the direct under layer pattern to the temperature detecting element through the substrate
Data Source
AI summary
In an electronic device, a heat generation part pattern is connected to a heat generating element to heat from the heat generating element. A temperature detecting element is disposed adjacent to a first surface of a substrate. A direct under layer pattern is disposed on a second surface of the substrate opposite to the temperature detecting element in an area including a portion corresponding to the temperature detecting element. An interlayer connection pillar connects between the heat generation part pattern and the direct under layer pattern to conduct heat. The heat generated from the heat generating element is effectively conducted to the temperature detecting element through the heat generation part pattern, the interlayer connection pillar, and the direct under layer pattern, and thus the temperature detecting element accurately detects the temperature of the heat generating element.