Substrate Thermal Imaging for Uniform Processing Control
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Solution Overview
Problem
Existing substrate processing apparatuses struggle to maintain uniformity of quality due to discrepancies between predicted and actual substrate temperature distributions during processing, leading to inconsistent processing outcomes.
Innovation Solution
Incorporation of a region photographing unit to capture thermal images of the substrate during processing, allowing for real-time temperature data calculation and adjustment, along with a calculation unit to process these images for accurate temperature distribution analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pre-processing temperature prediction is used, then the processing can be performed without real-time monitoring, but the uniformity of substrate quality deteriorates due to considerable difference between predicted and real temperature distribution
Solution Approach 1:
The patent implements a feedback mechanism by using a camera to capture real-time thermal images of the substrate during processing, converting these images into temperature distribution data, and using this data to adjust processing conditions. This closed-loop feedback system eliminates the discrepancy between predicted and actual temperature distributions, thereby improving substrate quality uniformity.
Solution Approach 2:
The patent replaces the traditional mechanical thermocouple measurement system with an optical measurement system using a camera. This substitution allows for non-contact, real-time temperature field measurement across the entire substrate surface, providing comprehensive temperature distribution data that mechanical point measurements cannot achieve.
2Manufacturing precision
If real-time temperature monitoring is implemented, then the uniformity of substrate quality improves, but the device complexity increases due to additional photographing and calculation units
Solution Approach 1:
The patent makes the camera serve multiple functions: it acts as both a thermal imaging device for temperature measurement and a alignment reference device. By utilizing the same hardware component for multiple purposes, the system avoids the need for separate measurement and alignment devices, thereby reducing overall system complexity while maintaining improved substrate quality uniformity.
Solution Approach 2:
The system uses the substrate's own thermal radiation characteristics to generate temperature data without requiring external heating elements or complex sensing infrastructure. The photographing unit captures inherent thermal information, and the calculation unit processes this data self-sufficiently, making the system relatively simple despite its enhanced measurement capabilities.
3Productivity
If traditional alignment operations are performed, then the photographing unit can be positioned, but the alignment time is lengthy which reduces productivity
Solution Approach 1:
The patent uses the photographing unit to create a visual copy or image of the substrate and its temperature distribution. This optical copy allows for rapid alignment verification and adjustment without requiring time-consuming physical measurements or iterative positioning, thereby significantly reducing alignment time and improving productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the uniformity of processing quality by aligning the region photographing unit more easily, reducing alignment time, and improving temperature distribution accuracy, thereby increasing productivity.
Implementation Method 1
a region photographing unit photographing a photographing region to obtain a thermal image of the photographing region
Implementation Method 2
a calculation unit calculating temperature data of a substrate from the thermal image
Data Source
AI summary
The present inventive concept relates to a substrate processing apparatus comprising: a chamber providing a processing space; a lid for covering the top of the chamber; a substrate support part supporting at least one substrate and rotating about a rotation axis such that the substrate passes through an imaging area; a gas injection part for injecting a process gas toward the substrate support part; an area image capturing part for capturing an image of the imaging area to obtain a thermal image of the imaging area; and a calculation part for calculating the temperature data of the substrate from the thermal image.