Substrate Thermal Vias and Planes for Compact Device Heat Dissipation
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Solution Overview
Problem
Compact electronic devices, such as clustered transceivers, face challenges in heat dissipation due to limited surface area for heat radiation and restricted airflow, leading to undesirable temperature management.
Innovation Solution
A substrate with thermal vias and planes is used to conduct heat from electronic components to a heat sink, optimizing heat transfer through a system of thermally coupled vias and planes, ensuring effective heat dissipation even in compact configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic devices are compacted into clustered configurations, then device density and integration are improved, but heat dissipation capability deteriorates due to limited surface area and restricted airflow
Solution Approach 1:
The patent transitions heat dissipation from a two-dimensional surface-based approach to a three-dimensional subsurface approach by embedding thermal planes within the substrate and creating thermal conduits that extend through multiple layers, allowing heat to be conducted away from compacted components in clustered configurations through internal pathways rather than relying solely on external surface area
Solution Approach 2:
The patent introduces thermal planes as intermediary structures embedded within the substrate, which act as heat transfer mediators between heat-generating electronic components and heat dissipation pathways. These thermal planes conduct heat laterally through the substrate interior, enabling effective thermal management in compact clustered devices where direct heat sink attachment is limited
2Productivity
If transceivers are ganged into multiple cages in compact clusters, then device integration is improved, but heat retention increases due to limited airflow reaching individual modules
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments by creating separate thermal planes and thermal conduits for different regions of the substrate, allowing each clustered transceiver module to have dedicated thermal management pathways that independently conduct heat away from individual modules even in tightly packed configurations
Solution Approach 2:
The patent replaces reliance on mechanical airflow (convection cooling) with a thermally conductive material system (conduction cooling) by embedding thermal planes and conduits within the substrate, enabling effective heat removal from clustered transceivers without depending on airflow reaching each individual module
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables controlled cooling of electronic components by efficiently conducting heat away from compact devices to a heat sink, managing temperature effectively even in environments with limited airflow.
Implementation Method 1
A substrate with thermal vias and planes is used to conduct heat from electronic components to a heat sink, optimizing heat transfer through a system of thermally coupled vias and planes
Data Source
AI summary
Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.