Substrate Module Layout for Protected Thermistor Placement
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Solution Overview
Problem
Existing light emitting modules do not effectively protect components, such as thermistors, from external factors like light and heat, especially when these components are not housed within the light emitting device.
Innovation Solution
A substrate module design that includes a substrate with specific wiring regions and connection components, where a protected component is positioned between the power receiving devices and the connection components, and a protection portion is provided to shield the component from external influences, including light and heat, using a structure that ensures electrical connectivity without direct contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the thermistor is disposed outside the light emitting device, then it can be easily accessed and replaced, but it becomes vulnerable to external light and heat damage
Solution Approach 1:
The module is divided into distinct functional zones: a protected region where light-sensitive components are shielded by the light emitting device body, and an accessible region where the thermistor is positioned outside the light emitting device housing for easy access. The substrate integrates both regions, allowing the thermistor to be externally accessible while light-sensitive components remain protected within the sealed light emitting device housing.
Solution Approach 2:
The light emitting device housing serves as an intermediary protective barrier between external light sources and the light-sensitive components (such as the photodiode) positioned within it. The housing physically blocks external light from reaching these sensitive components, while the thermistor is positioned in an intermediate location that is externally accessible but still thermally coupled to the light emitting device for accurate temperature measurement.
2Reliability
If a protection structure is added to shield components from external factors, then component reliability improves, but module complexity increases
Solution Approach 1:
The housing of the light emitting device is designed to serve multiple functions simultaneously: it protects the light emitting elements, shields light-sensitive components from external light, provides thermal management, and creates a sealed environment. By merging these functions into a single integrated structure, the need for separate protection components is eliminated, maintaining reliability while minimizing added complexity.
Solution Approach 2:
The light emitting device housing is designed as a multi-functional component that simultaneously provides: (1) mechanical protection for internal components, (2) optical shielding for light-sensitive elements, (3) thermal management through heat dissipation paths, and (4) environmental sealing. This universal design approach protects components from multiple external factors without requiring separate dedicated structures for each protection function.
3Reliability
If the protected component is positioned between power receiving devices and connection components, then electrical connectivity is maintained without direct contact, but spatial arrangement becomes more constrained
Solution Approach 1:
The substrate is designed with a multi-layer configuration where components are arranged in different vertical planes. The protected component is positioned on one layer while power receiving devices and connection components are arranged on adjacent layers, allowing electrical connectivity through vertical vias and conductive paths while maintaining horizontal separation for protection. This three-dimensional arrangement on the substrate enables reliable electrical connections without direct physical contact between components.
Data Source
AI summary
A substrate module includes: a substrate having top and bottom surfaces and comprising, at the top surface, a plurality of first wiring regions and a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions; one or more power receiving devices disposed on the plurality of first wiring regions; a first connection component disposed on the plurality of second wiring regions, wherein the first connection component has opposite ends in a first direction; and a protected component disposed on the top surface of the substrate. In a top plan view, (i) the protected component is located between two straight lines passing through the respective opposite ends of the first connection component and extending in a second direction perpendicular to the first direction, and (ii) the protected component is located between the one or more power receiving devices and the first connection component.