Multilayer Substrate Thickness Adjustment Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thermoplastic resin multilayer substrates experience positional displacement of conductor patterns during heat-pressing due to the flow of buffer sheets, which affects the accuracy and stability of the laminated structure.
Innovation Solution
Incorporating a level-difference eliminating through hole and a thickness adjustment member made of the same thermoplastic resin, which extends over both the resin layer and the conductor pattern, to distribute stress evenly and prevent displacement during heat-pressing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If thermoplastic resin sheets are heat-pressed to form a multilayer substrate, then the resin layers are bonded together to create a stable structure, but the buffer sheet flows during heat-pressing causing positional displacement of conductor patterns
Solution Approach 1:
A through hole is formed in the buffer sheet at a position different from the conductor pattern before heat-pressing. A thickness adjustment member is then inserted into this through hole to adjust the thickness of the buffer sheet. This preliminary preparation prevents the buffer sheet from flowing during heat-pressing, thereby preventing positional displacement of the conductor pattern while maintaining structural stability.
Solution Approach 2:
The thickness adjustment member is inserted only at specific locations (through holes) in the buffer sheet, creating local thickness variations. This allows the buffer sheet to have different thicknesses at different positions, preventing uniform flow during heat-pressing while maintaining the overall structural stability of the multilayer substrate.
2Length of stationary object
If the buffer sheet is made thinner to reduce overall substrate thickness, then the multilayer substrate becomes more compact, but the difference in thickness between conductor and non-conductor areas increases causing greater displacement
Solution Approach 1:
Instead of uniformly thinning the buffer sheet, a thickness adjustment member is inserted only at specific through hole locations. This creates local thickness variations that compensate for the thickness difference between conductor and non-conductor areas, preventing displacement while maintaining overall compactness.
Solution Approach 2:
The thickness adjustment member acts as an intermediary element inserted into the through hole of the buffer sheet. It mediates the thickness difference between conductor and non-conductor areas by providing localized thickness adjustment, preventing displacement while allowing the overall substrate to remain compact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces or eliminates positional displacement of the conductor patterns, ensuring the stability and accuracy of the multilayer substrate's structure, particularly in coils, by providing uniform stress distribution and maintaining the thickness difference between conductor and non-conductor areas.
Implementation Method 1
When the heat-pressing is performed, a flow of the buffer sheet occurs, and the positional relationship between the conductor pattern and the slit may be shifted due to the flow of the buffer sheet
Data Source
AI summary
A multilayer substrate includes a laminated body including thermoplastic resin layers, a conductor pattern, a level-difference eliminating through hole, and a thickness adjustment member. The conductor pattern is on a main surface of one of the resin layers and is in the laminated body. The level-difference eliminating through hole is located at a position different from the conductor pattern in a planar view of the laminated body and penetrates the resin layer in a thickness direction. The thickness adjustment member is made of the same material as the resin layers, is located in the through hole, and has a thickness greater than a thickness of the resin layer.