Multi-layer Substrate Using Thin Dielectric Layers for Signal Integrity
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Solution Overview
Problem
Existing multi-layer substrates manufactured by hot pressing and adhering require numerous materials and complex processes, leading to difficulties in controlling process quality, high manufacturing costs, and limitations in miniaturization due to thick dielectric layers, which result in signal interference, impedance mismatch, and reduced flexibility.
Innovation Solution
A method involving the use of a carrier to alternately form thin dielectric and metal structure layers through coating and etching processes, eliminating the need for prepregs, with dielectric layers serving as solder masks and vias formed to connect metal layers, reducing thickness and materials while ensuring impedance matching and improved signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If hot pressing and adhering with prepregs is used to manufacture multi-layer substrate, then different layers can be adhered to each other, but the substrate thickness becomes too thick and signal interference occurs
Solution Approach 1:
The invention extracts and eliminates the prepreg layers from the traditional multi-layer substrate structure. By removing the prepregs that cause excessive thickness, the patent achieves layer adhesion through alternative means (direct lamination and bonding processes) while maintaining reduced overall substrate thickness, thereby solving the signal interference problem caused by thick dielectric layers.
Solution Approach 2:
The invention changes the thickness parameter of the dielectric layers by eliminating prepregs and using thin dielectric materials directly. This parameter change reduces the overall substrate thickness from the traditional ~600μm for 8-layer substrates to a much thinner configuration, improving signal integrity while maintaining layer adhesion through modified manufacturing processes.
2Strength
If numerous materials including prepregs are used for layer adhesion, then different layers can be adhered, but process quality control becomes difficult and manufacturing cost increases
Solution Approach 1:
The invention extracts and removes the prepreg material from the manufacturing process. By eliminating this intermediate material, the patent reduces the number of materials that need to be managed, stored, and processed, thereby simplifying process quality control and reducing manufacturing complexity while still achieving effective layer adhesion through direct bonding methods.
Solution Approach 2:
The invention merges the functions of multiple separate materials (core, prepreg, solder mask) into a more integrated structure. By eliminating prepregs and using thin dielectric layers that can serve multiple functions, the patent reduces material complexity and simplifies the manufacturing process, making quality control more manageable.
3Strength
If thick dielectric layers are used for layer adhesion, then layers can be adhered together, but signal integrity deteriorates due to crosstalk and interference
Solution Approach 1:
The invention extracts the thick dielectric layers (prepregs) that cause signal interference and replaces them with thin dielectric materials. This removal eliminates the source of crosstalk and electromagnetic interference between adjacent signal lines, improving signal integrity while maintaining layer adhesion through alternative bonding approaches.
Solution Approach 2:
The invention changes the dielectric layer thickness parameter from thick (traditional prepreg ~50μm each) to thin (reduced thickness), fundamentally altering the electromagnetic field distribution and reducing parasitic effects. This parameter change improves signal integrity by minimizing crosstalk and interference between adjacent layers and signal lines.
Data Source
AI summary
Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein.