Substrate Thinning Apparatus Synchronized Wheel Tip Cleaning
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Solution Overview
Problem
As semiconductor products become lighter, thinner, and smaller, maintaining the reliability of significantly thin semiconductor devices during the substrate thinning process becomes increasingly difficult due to challenges in grinding and cleaning techniques.
Innovation Solution
A substrate thinning apparatus and method that includes a chuck table, a rotatable grinding device with wheel tips, and a synchronized cleaning device to ensure precise grinding and continuous cleaning of the wheel tips during the process, preventing scratches and maintaining device reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate thickness is reduced to meet lighter and thinner semiconductor product demands, then the semiconductor product becomes lighter and thinner, but the reliability of the semiconductor device deteriorates
Solution Approach 1:
The wheel tip is cleaned of foreign substances before the grinding process begins, preventing contamination during substrate thinning. This preliminary cleaning action ensures that the grinding process proceeds without introducing defects that would compromise device reliability in thin substrates
Solution Approach 2:
The foreign substances that would normally cause scratches and reduce reliability are removed and converted into a separate waste stream. By eliminating these harmful contaminants before they can damage the thin substrate, the cleaning process transforms a potential reliability issue into a controlled waste removal operation
2Length of moving object
If conventional grinding and cleaning techniques are used, then the substrate can be thinned, but foreign substances remain on the wheel tip causing scratches and reducing device reliability
Solution Approach 1:
The harmful foreign substances are extracted from the wheel tip surface through a dedicated cleaning process. The cleaning apparatus removes contaminants by applying liquid and mechanical action to the wheel tip, separating the foreign substances from the grinding system before they can transfer to the substrate
Solution Approach 2:
A liquid cleaning medium serves as an intermediary between the wheel tip and the substrate. This liquid carries away foreign substances from the wheel tip surface, preventing direct contact between contaminants and the substrate during grinding operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of significantly thin semiconductor devices with substantial reliability by effectively thinning substrates while preventing damage from foreign substances, ensuring precise control over thickness and maintaining the integrity of semiconductor devices.
Implementation Method 1
projecting a compressed fluid onto the at least one of the plurality of wheel tips
Implementation Method 2
the projecting is performed contemporaneously with the at least partial grinding
Data Source
AI summary
A substrate thinning apparatus includes a chuck table capable of supporting a substrate, a rotatable grinding device which includes a wheel tip capable of grinding the substrate supported by the chuck table, and a cleaning device configured to perform synchronized cleaning of the wheel tip while the grinding device is rotated. When the substrate thinning apparatus is used, even an extremely thin semiconductor device can be fabricated with substantial reliability.