Substrate Through-Hole Layout for Clean Sintered Component Bonding
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Solution Overview
Problem
Existing substrate attachment methods using pre-applied sintering paste result in inadequate adhesion during transport, leading to slippage and potential contamination from pre-fixing agent residues, which impair the sintered bond durability and contaminate adjacent areas.
Innovation Solution
A substrate arrangement with through-holes and a pre-fixing agent composition that liquefies during sintering, allowing capillary absorption into the holes, preventing residue leakage and ensuring reliable adhesion and contamination-free bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a pre-fixing agent is applied to prevent substrate slippage during transport, then adhesion strength is improved, but residues leak laterally to contaminate the substrate and electronic component
Solution Approach 1:
The harmful pre-fixing agent residues are extracted from the bonding interface by introducing through-holes that channel the residues away from the substrate surface and electronic component, preventing contamination while maintaining adhesion strength
Solution Approach 2:
The through-holes act as an intermediary structure that receives and contains the pre-fixing agent residues, preventing direct contact between the residues and the substrate surface or electronic component, thus eliminating contamination
2Reliability
If pre-fixing agent residues are contained, then bond durability is maintained, but the substrate structure becomes more complex with through-holes
Solution Approach 1:
The substrate is designed with through-holes creating a porous structure that naturally captures and contains pre-fixing agent residues, maintaining bond durability while adding minimal structural complexity compared to solid substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively contains pre-fixing agent residues within the through-holes, maintaining bond durability and preventing contamination, thus ensuring reliable and clean bonding of substrates to electronic components.
Implementation Method 1
at least one material M melting in the range of 30 to 180°C selected from the group consisting of (i) organic compounds melting in the range of 30 to 180°C
Implementation Method 2
portions or residues of the pre-fixing agent can be absorbed into the at least one through-hole by means of a capillary action
Data Source
Figure 1~2
Figure 3a~3b
AI summary
A substrate arrangement for connection with an electronic component (50, 50'), comprising: at least one substrate (30, 30') with a first side and a second side opposite the first side; at least one contacting medium layer (90, 90') arranged at least sectionally on the first side of the substrate (30, 30'); at least one pre-fixing medium (70, 70') arranged at least sectionally on a side of the contacting medium layer (90, 90') facing away from the substrate (30, 30') and/or at least sectionally on the first side of the substrate (30, 30'), wherein the substrate (30, 30') has at least one through-opening (110, 110') with a first opening and a second opening from the first side to the opposite second side. The present invention also relates to a method for manufacturing a substrate arrangement and further to a method for connecting at least one electronic component (50, 50') to a substrate arrangement.