Substrate Through-Hole Wiring for Compact Electronic Apparatus
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Solution Overview
Problem
There is a need for improved methods to efficiently and cost-effectively mount wiring in electronic apparatuses, particularly in display devices, to reduce the frame size and manufacturing costs while ensuring reliable electrical connections.
Innovation Solution
The solution involves an electronic apparatus comprising a first substrate with a conductive layer and a second substrate with a conductive layer, where a connecting material is used to electrically connect the layers through a system of holes and openings, with a second hole penetrating the first substrate and connecting to a first hole in the second substrate, allowing for a conductive material to fill and secure the connection, thereby reducing the need for additional wiring substrates and minimizing frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate wiring substrates are used to connect conductive layers, then electrical connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the wiring function directly into the substrate structure by forming conductive layers on the substrate surfaces and creating through-substrate holes for electrical connections. This eliminates the need for separate wiring substrates while maintaining connection reliability, thereby reducing device complexity and manufacturing cost.
Solution Approach 2:
The substrate is designed to perform multiple functions: it serves as both the structural base and the wiring carrier. The conductive layers formed on the substrate surfaces and the through-substrate holes integrated into the substrate structure enable the substrate to provide both mechanical support and electrical connection functions, eliminating the need for additional dedicated wiring substrates.
2Reliability
If traditional wiring mounting methods are used, then electrical connections are established, but manufacturing cost and frame size increase
Solution Approach 1:
The wiring mounting process is merged with the substrate manufacturing process. Conductive layers are formed directly on the substrate surfaces, and through-substrate holes are created as part of the substrate structure. This integration eliminates separate wiring mounting steps, reducing manufacturing cost and complexity while ensuring reliable electrical connections.
Solution Approach 2:
The conductive layers and through-substrate holes are prepared in advance during substrate manufacturing, before the final assembly. This preliminary preparation of wiring structures integrates the wiring mounting into the substrate fabrication process, eliminating subsequent costly wiring installation steps and reducing overall manufacturing cost.
3Length of stationary object
If conductive layers are positioned close to each other, then frame size is reduced, but electrical insulation and connection stability become difficult to ensure
Solution Approach 1:
The patent utilizes the thickness dimension of the substrate to achieve electrical insulation. By forming conductive layers on opposite surfaces of the substrate and creating through-substrate holes that pass completely through the substrate thickness, the substrate's thickness provides sufficient electrical insulation distance between adjacent conductive layers while allowing direct electrical connection through the holes, enabling compact frame size without compromising insulation reliability.
Data Source
AI summary
According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, and a connecting material. The second substrate includes a second basement and a second conductive layer. The second basement has a third surface opposed to the first conductive layer and a fourth surface and is spaced apart from the first conductive layer. The second substrate has a first hole penetrating the second basement. The first substrate has a second hole. A third opening of the second hole is smaller than a first opening of the first hole. A connecting material connects the first conductive layer and the second conductive layer via the first hole.