Base Substrate Through-Holes Prevent Burr Electrical Shorts
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Solution Overview
Problem
Conventional methods for manufacturing base substrates for optical devices, such as LEDs, result in burr generation during sawing or dicing processes due to differences in hardness between conductive and insulation layers, leading to electrical shorts.
Innovation Solution
A base substrate configuration with multiple conductive layers stacked in one direction, alternately separated by insulation layers, and featuring through-holes penetrating the insulation layer at cut surfaces, along with cavities and resistor sections to prevent burr formation and ensure electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional sawing or dicing processes are used to separate optical devices from the base substrate, then the manufacturing process can be completed, but burrs are generated due to hardness differences between conductive and insulation layers, causing electrical shorts
Solution Approach 1:
The patent applies preliminary action by forming through-holes at the insulation layer positions before the cutting process. These pre-formed holes provide burr collection pathways that prevent burrs from bridging conductive layers during subsequent sawing or dicing operations, thereby eliminating electrical shorts while maintaining manufacturing productivity
Solution Approach 2:
The through-holes act as intermediary structures that mediate between the cutting process and the insulation layer. By providing dedicated pathways for burr collection, the through-holes prevent direct contact between burrs and the insulation layer, thus maintaining electrical insulation reliability without affecting the cutting process
2Ease of manufacture
If the base substrate is cut using conventional methods, then separation of optical devices is achieved, but burrs cross over the insulation layer due to material hardness differences, creating electrical shorts
Solution Approach 1:
The patent extracts the harmful burrs from the cut surface by providing through-holes that lead burrs into collection regions away from the functional areas. This extraction approach allows conventional cutting methods to be used while removing the detrimental effect of burrs, maintaining both ease of manufacture and manufacturing precision
Solution Approach 2:
The patent converts the harmful burrs generated during cutting into a manageable issue by directing them into through-holes that lead to collection regions. Instead of preventing burr generation entirely, the design accepts burrs as inevitable but redirects them to harmless locations, thus converting a manufacturing defect into a controlled feature
Data Source
AI summary
A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.