Substrate Structure With Through Holes For Probe Testing
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Solution Overview
Problem
In semiconductor manufacturing, the inability to test electrical connections between topmost and bottommost circuit layers due to the carrier covering the lower surface of the wiring structure leads to defects and waste of semiconductor dies, and existing methods for exposing the bottommost layer through drilling can damage the wiring structure.
Innovation Solution
A substrate structure with a wiring structure on a supporter that includes through holes to expose pad portions of the circuit layers, allowing for testing before removing the supporter, using a plugging material that can be easily removed without damaging the structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the carrier covers the lower surface of the wiring structure, then the wiring structure is protected and supported, but the probe cannot reach the bottommost circuit layer for testing
Solution Approach 1:
The patent divides the carrier into two functional regions: a first region that remains intact to support the wiring structure, and a second region with a removed portion that exposes the bottommost circuit layer for probe testing. This segmentation allows simultaneous protection and accessibility.
Solution Approach 2:
The patent extracts or removes a portion of the carrier to create an opening that allows the probe to reach the bottommost circuit layer. This removal is selective and localized, maintaining the overall structural integrity while enabling testing functionality.
2Ease of operation
If drilling is used to expose the bottommost circuit layer, then probe access is enabled, but the wiring structure may be damaged
Solution Approach 1:
The patent performs the carrier material removal in advance during the manufacturing process, before the wiring structure is fully assembled and before testing occurs. This preliminary action creates a pre-formed opening that eliminates the need for damaging drilling operations later.
Solution Approach 2:
The patent uses the carrier itself as an intermediary structure that is selectively modified to enable probe access. By removing portions of the carrier, it becomes a facilitator of testing rather than an obstacle, without requiring external drilling operations that could damage the wiring.
3Ease of operation
If the wiring structure is tested after carrier removal, then complete access is achieved, but the wiring structure is more vulnerable to damage
Solution Approach 1:
The patent enables testing to occur while the wiring structure remains supported by the carrier. The selective removal of carrier portions creates test access points without compromising the overall structural support, allowing testing to be performed in a protected state rather than after complete carrier removal.
Data Source
AI summary
A substrate structure includes a wiring structure and a supporter. The wiring structure includes a first dielectric structure, a first circuit layer, a second dielectric structure and a second circuit layer. The first circuit layer is disposed on the first dielectric structure. The second dielectric structure covers the first dielectric structure and the first circuit layer. A pad portion of the first circuit layer is exposed from the first dielectric structure, and the second circuit layer protrudes from the second dielectric structure. The supporter is disposed adjacent to the first dielectric structure of the wiring structure, and defines at least one through hole corresponding to the exposed pad portion of the first circuit layer.