Substrate Tiling Process for Narrow-Bezel Electronic Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current manufacturing processes for narrow bezel or bezel-less electronic devices face challenges in efficiently forming large-sized electronic devices through tiling, requiring improved methods to enhance manufacturing efficiency and reduce bezel width.
Innovation Solution
A manufacturing method involving the bonding and cutting of substrates with integrated circuit layers and electronic elements, followed by wire formation and encapsulation, to create a tiled electronic device structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If traditional manufacturing processes are used for narrow bezel or bezel-less electronic devices, then device size and integration are improved, but manufacturing efficiency and yield deteriorate
Solution Approach 1:
The manufacturing process is divided into multiple stages: forming first and second substrates separately with their respective circuit layers and electronic elements, bonding them together to form an electronic module, and then cutting the module into multiple device units. This segmentation allows parallel processing of substrates, improving manufacturing efficiency while enabling large-sized devices through tiling of multiple units.
Solution Approach 2:
Circuit layers and electronic elements are prepared and disposed on substrates before the bonding and cutting steps. This preliminary action allows complete electronic components to be formed on each substrate prior to assembly, ensuring that each cut device unit contains all necessary functional elements, thereby improving yield and manufacturing efficiency.
2Productivity
If substrates are cut after bonding to form multiple devices, then manufacturing efficiency is improved, but manufacturing precision and electrical connection reliability worsen
Solution Approach 1:
Wire connections are formed on the side surfaces of the electronic module in addition to the top and bottom surfaces. This three-dimensional wire arrangement allows electrical connections to span across cut boundaries, ensuring that devices cut from the bonded substrate maintain reliable electrical connectivity without requiring extremely precise cutting alignment.
Solution Approach 2:
Wires serve as intermediary elements that bridge the circuit layers of different substrates and electronic elements. These wires are formed to extend across the cutting plane, acting as a mediator that maintains electrical continuity even when the physical substrate is divided, thereby reducing the precision requirements for cutting operations.
3Reliability
If wires are formed on side surfaces of electronic module, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The formation of wires on side surfaces, top surfaces, and bottom surfaces is integrated into a unified wire formation process that occurs after bonding but before final device separation. This merging of wire formation operations across multiple surfaces simplifies the overall manufacturing flow while ensuring comprehensive electrical connectivity, balancing reliability improvement with process complexity management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of narrow bezel or bezel-less electronic devices by improving manufacturing efficiency and yield, allowing for the formation of large-sized electronic devices through precise substrate manipulation and electrical connections.
Implementation Method 1
bonding the first substrate and the second substrate to form an electronic module
Data Source
AI summary
A manufacturing method includes providing a first substrate including a circuit layer and an electronic element disposed on the circuit layer, providing a second substrate, bonding the first substrate and the second substrate to form an electronic module, cutting the electronic module, forming a wire on a first surface exposed after cutting the electronic module and on a second surface of the electronic module, wherein the first surface is adjacent to the second surface and the wire is electrically connected to the circuit layer, and disposing a driving element on the second surface of the electronic module to be electrically connected to the wire.